Welcome: Insoll Tools Technology CO.,LTD


Development and application fields of diamond wire saw

The experimental results of cutting various hard and brittle materials show that the diamond wire saw has obvious cutting performance advantages, the linear speed is as high as 50 ~ 60m / s, the cutting efficiency is high, and the feed speed of polysilicon chips is more than 5mm / min, up to 30mm / min. This is beyond the reach of diamond long wire saw. Therefore, it is very suitable for multi chip cutting of hard and brittle materials such as polycrystalline silicon and monocrystalline silicon and other processes. For example, it can replace the existing diamond band saw cutting machine to cut monocrystalline silicon or polycrystalline silicon.

Sapphire has a hardness of 9, which is difficult to process. The larger the crystal, the harder it is to process. Giving full play to the performance advantages of the ring line and overcoming the short board is the key way to solve the upstream cutting and processing production chain of sapphire.

The market demand for other materials such as artificial photoelectric crystals, functional ceramics and target cutting is also quite large. At present, a large number of diamond band saws are still used in China, resulting in large material loss and uneven section.



    Contact: Insoll Tools Technology CO.,LTD

    Phone: +86-15617981759

    Tel: +86-371-56622880

    Email: info@insolltools.com

    Add: Building No 2, 53 Science Avenue, High-tech Development Area, Zhengzhou, China