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2022 Descripción general de la industria de obleas de semiconductores

2022 Descripción general de la industria de obleas semiconductoras La oblea de silicio semiconductor es el portador para la fabricación de chips, also known as silicon wafer because the raw material is silicon.After planning and management-free silicon refining, purification, monocrystalline silicon production, wafer forming and other processes, it can enter the subsequent links such as chip single-channel etching, which is the most important pre-process for chip manufacturing.The concept mainly includes: companies that develop and manufacture semiconductor wafers, silicon wafers and polished wafers.Classified by processAccording to the type of...

2022-07-19PredeterminadoLeer más...

Dirección de desarrollo del equipo de corte de obleas de silicio con alambre de diamante

1) High line speed and high production capacity support the reduction of single GW investmentAccording to the theory of fracture mechanics and the properties of silicon materials, when the maximum cutting depth of diamond abrasive grains is greater than the critical cutting depth of silicon materials, the transition from plastic cutting to brittle fracture cutting will occur. Por lo tanto, within the allowable range of the diamond wire load, appropriately increasing the steel wire speed in the multi-wire cutting process is...

2022-06-16PredeterminadoLeer más...

Cambio dimensional de obleas de silicio fotovoltaico

El tamaño de las obleas de silicio fotovoltaico se deriva de las obleas de silicio semiconductoras. En términos de desarrollo , photovoltaics lag behind semiconductors by 1 Para 2 generations. Over the years, the size of semiconductor silicon wafers has continued to increase, and photovoltaic silicon wafers have also experienced a process from small to large.Driven by the dilution of cost and the improvement of module quality, in the 40 years since 1981, the size of photovoltaic silicon wafers has grown from 100mm...

2022-06-02PredeterminadoLeer más...

Flujo de procesamiento de lingotes de silicio en la industria de semiconductores

En la etapa de preparación de obleas de silicio monocristalino, the silicon ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy and surface quality to prepare for planarization for lithography and other processes in the first half of the IC process. Ultra-smooth and damage-free substrate surface are required here.For silicon wafers with a diameter of ≤200mm, the traditional silicon wafer processing process is:single crystal growth → cropping → outer diameter barrel grinding → flat edge or V-groove...

2022-05-27PredeterminadoLeer más...