Noticias

Proceso tradicional de producción de células solares

Traditional solar cell production process Key Takeaways Traditional solar cell production starts with silicon wafer manufacturing and proceeds through texturing, difusión, etching, coating and metallization. Wafer slicing quality — kerf, TTV and surface damage — directly affects cell efficiency and yield. Before we always described the manufacturing principle and processing process of silicon wafers, Hoy describiremos el proceso de producción de las células solares tradicionales. La producción celular tradicional se puede resumir principalmente en 6 Pasos. Desde la perspectiva del proceso tradicional de fabricación de células, it...

agosto 2, 2022Por defectoLeer más...

El boom de las obleas de silicio en la industria fotovoltaica

The boom of silicon wafers in the photovoltaic industry Key Takeaways Carbon-neutrality goals worldwide have made photovoltaics the fastest-growing source of demand for silicon wafers. PV wafer economics are driven by kerf loss and throughput, which is the main reason diamond wire replaced slurry saws across the industry. Larger wafer formats and thinner wafers are the PV industry's structural cost-reduction path, and both raise the bar for cutting precision. Under the background of the carbon neutralization goal and the accelerated application of global clean energy,...

julio 22, 2022Por defectoLeer más...

2022 Descripción general de la industria de obleas de semiconductores

2022 Semiconductor Wafer Industry Overview Key Takeaways Semiconductor silicon wafers are the carrier substrate for chip manufacturing, and the wafer industry is highly concentrated and technology-intensive. Industry development is driven by larger wafer diameters, tighter flatness specs and growing demand from logic, memory and power devices. La oblea de silicio semiconductor es el portador para la fabricación de chips, También conocida como oblea de silicio porque la materia prima es silicio. Después de la planificación y el refinado de silicio sin gestión, purificación, Producción de silicio monocristalino, Conformación de obleas y otros procesos, it can enter the...

julio 19, 2022Por defectoLeer más...

Tendencias de Equipos de Corte de Obleas de Silicio con Hilo de Diamante

1) High line speed and high production capacity support the reduction of single GW investment According to the theory of fracture mechanics and the properties of silicon materials, when the maximum cutting depth of diamond abrasive grains is greater than the critical cutting depth of silicon materials, the transition from plastic cutting to brittle fracture cutting will occur. Por lo tanto, within the allowable range of the diamond wire load, appropriately increasing the steel wire speed in the multi-wire cutting process is beneficial...

junio 16, 2022Por defectoLeer más...

Cambio dimensional de obleas de silicio fotovoltaico

Key Takeaways Photovoltaic silicon wafer sizes evolved from semiconductor wafer formats, with PV historically lagging semiconductors in dimension standards. Wafer dimensions keep growing (from 156 mm to 182/210 mm classes) because larger wafers cut module cost per watt. Larger and thinner wafers raise the precision bar for slicing equipment and diamond wire. El tamaño de las obleas de silicio fotovoltaico se deriva de las obleas de silicio semiconductoras. En términos de desarrollo , photovoltaics lag behind semiconductors by 1 Para 2 generations. A lo largo de los años, the size of...

junio 2, 2022Por defectoLeer más...

Silicon Ingot Processing in Semiconductor Industry

Key Takeaways In semiconductor wafer preparation, single-crystal silicon ingots are processed into bare wafers with high surface accuracy for lithography. The ingot processing flow includes cropping, molienda, Rebanar, Chaflanar, lapping and polishing, with slicing quality setting downstream workload. En la etapa de preparación de obleas de silicio monocristalino, the silicon ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy and surface quality to prepare for planarization for lithography and other processes in the first half of the IC process. Ultra-smooth...

mayo 27, 2022Por defectoLeer más...