Notícia

2022 Visão geral da indústria de wafer semicondutor

2022 Visão geral da indústria de wafer semicondutor Wafer de silício semicondutor é o transportador para a fabricação de chips, also known as silicon wafer because the raw material is silicon.After planning and management-free silicon refining, purification, monocrystalline silicon production, wafer forming and other processes, it can enter the subsequent links such as chip single-channel etching, which is the most important pre-process for chip manufacturing.The concept mainly includes: companies that develop and manufacture semiconductor wafers, silicon wafers and polished wafers.Classified by processAccording to the type of...

Direção de desenvolvimento de equipamento de corte de wafer de silício com fio diamantado

1) High line speed and high production capacity support the reduction of single GW investmentAccording to the theory of fracture mechanics and the properties of silicon materials, when the maximum cutting depth of diamond abrasive grains is greater than the critical cutting depth of silicon materials, the transition from plastic cutting to brittle fracture cutting will occur. Therefore, within the allowable range of the diamond wire load, appropriately increasing the steel wire speed in the multi-wire cutting process is...

Mudança dimensional de wafers de silício fotovoltaico

O tamanho dos wafers de silício fotovoltaico é derivado de wafers de silício semicondutor. Em termos de desenvolvimento , photovoltaics lag behind semiconductors by 1 Para 2 generations. Over the years, the size of semiconductor silicon wafers has continued to increase, and photovoltaic silicon wafers have also experienced a process from small to large.Driven by the dilution of cost and the improvement of module quality, in the 40 years since 1981, the size of photovoltaic silicon wafers has grown from 100mm...

Fluxo de processamento de lingotes de silício na indústria de semicondutores

Na etapa de preparação do wafer de silício monocristal, the silicon ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy and surface quality to prepare for planarization for lithography and other processes in the first half of the IC process. Ultra-smooth and damage-free substrate surface are required here.For silicon wafers with a diameter of ≤200mm, the traditional silicon wafer processing process is:single crystal growth → cropping → outer diameter barrel grinding → flat edge or V-groove...