ESD150-3T 다이아몬드 와이어 톱 절단기

The Diamond Wire Loop Tabletop Cutting Equipment is a high-precision cutting tool specifically designed for laboratories, research institutions, and small-scale processing workshops. Utilizing diamond wire cutting technology, it is suitable for precision cutting of various hard and brittle materials. Characterized by high precision, 능률, and user-friendly operation, it is an ideal choice for scientific research and small-scale production.

제품 장점

1.고정밀 절단

The cutting precision reaches ±0.05mm, with a surface roughness as low as Ra 0.5μm, meeting the demands of high-precision processing.

Suitable for cutting ultra-thin materials, with a minimum cutting thickness of 0.1mm.

2.Multi-Functional Applicability

Capable of cutting various hard and brittle materials, including silicon wafers, 사파이어, 도예, 잔, 돌, 복합 재료, 그 외 다수.

Wide cutting thickness range, from 0.1mm to 50mm, catering to different material requirements.

3.High-Efficiency Cutting Speed

The cutting speed can reach up to 20mm/min, significantly improving experimental and production efficiency.

Automated cutting mode reduces manual intervention and enhances consistency.

4.Compact Desktop Design

The equipment features a small footprint, occupying only 0.5㎡, making it ideal for laboratories and small workshops.

The user-friendly interface supports one-click operation, ensuring ease of use.

5.Low Consumable Costs

The diamond wire has a long service life, with a single wire capable of cutting over 1000 meters of material, reducing consumable costs.

The equipment is easy to maintain and has low operating costs.

Cutting video：