ESG300-4T 8″(10″ 、12″ )Silicon Ingot Cropping Single Endless Diamond Wire Saw-Semiconductor/Solar Diamond Cutting

ESG300-4T 8″(10″ 、12″ )Silicon Ingot Cropping Single Endless Diamond Wire Saw-Semiconductor/Solar Diamond Cutting

Description

ESG300-4T 8″(10″ 、12″ )Silicon Ingot Cropping Single Endless Diamond Wire Saw

Breif Introduction :

ESG300-4T diamond wire saw machine is made to do silicon cut off/cropping, it uses diamond wire loop/endless diamond wire as cutting blade,far more small than diamond band saw.And there has less possibility of silicon edge break which decreases defective product rate.

The machine cut vertically, and it’s clamping device is made for silicon ingot, the moving roller and air pressure clamp protects silicon to be not damaged.Contact us to get more info about our silicon diamond wire saw series.

Silicon Ingot Cropping Single Endless Wire Saw

Parameter

Machine Size800*650*1600mm(L*W*H)
Machine Weight250Kg
Electric220V
Power1KW
Motor Speed2800RMP
Positioning Accuracy±0.03mm
Wire Length1580mm
Max Linear Speed38m/s
Loading Table Size250*300mm
Loading Capacity500Kg
Feed Length200*200mm(Y*Z axis)
Cutting Thickness1-200mm adjustable
Max Cutting Size200*200*200mm(L*W*H)
Feed MethodStepping
Water Tank Size680*610*540mm(150L)

 

Product Features

  • Made to do 8″、10″ 、12″ 、18″ etc.Silicon ingot cropping , it’s an 2 axis machine which can cut certian length section automatically.
  • The fuselage is waterproof which can do wet cut.
  • The tensioning system adopts adaptive tensioning system, there is no need to make tension force calculation.

  Application of ESG300-4T

Silicon cutting equipment

①、Endless diamond wire as cutting tool,faster linearspeed and faster cutting speed.

②、2 minites to install a new cutting wire

③、Less chipping and breakage.

④、Small kerf loss. wire dia 0.3 to 0.6 mm

⑤、One -directlion cut ,without commutation pattern thecutting surface is very good.

In addition, our cutting equipment can also be used for cutting Various metal and non-metallic composite materials, glass, rock, jade, monocrystalline silicon, silicon carbide, ceramics Epoxy board and other materials, especially suitable for cutting high priced and easily broken high hard brittle materials!If you have material cutting needs, you can contact us!

Product Advantages

                                   —— Our equipment VS Traditional equipment

1、Unidirectional Cutting——Faster linear speed and More sharp,No reversing mark!

2、Wire Saw More Cutting Edges ——High sharpness longer serving life!

3、Exquisite Equipment Craftsmanship——Less failure rate,Easier operation!

4、Less Cutting Kerf ——Save more material,Cutting result is more precision!

5、More Safe —— Detailed operation instructions and guidance,Less work injuries!

Accessory

Guiding wheels——This Rubber Coated wheel /pulley is made for endless diamond wire saw.There are some stock model and we can also provide customized spec .The Rubber Coated wheel have several wire grooves which increase the wheel’s life time.normally there are 3 wire grooves.

We can provide all part of endless wire saw machine to support machinery company build machines including endless cutting wire ,bearing,fiangeand so on.

wheel

Diamond Wire Loop——Diamond wire loop is a kind of  flexibility cutting tool, Coating diamond crystals onto the steel wire surface, mainly used for cutting hard and brittle materials, such as: sapphire, ceramic,  stone,  silicon, etc.

Diamond loop wire





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