Articles about diamond wire loops — the endless diamond cutting wire used for precision slicing of hard and brittle materials.
Was sind die Vorteile des Diamant-Drahtschleifenschneidens??
Die Diamant-Draht-Schleifen-Schneidtechnologie ist eine fortschrittliche Schneidtechnologie, die das traditionelle Freimörtelschneiden ersetzt, which is widely used in the field of silicon wafer cutting in photovoltaic and semiconductor industries. Its development process is as follows: Phase One: The Era of Free Abrasive Slurry Cutting Monopoly Prior to the maturation of diamond wire technology, the cutting of solar cells and semiconductor silicon wafers predominantly relied on Free Abrasive Slurry Cutting (FASC). This method involved high-speed steel wires carrying a slurry—a mixture of...
