Nouvelles

Processus traditionnel de production de cellules solaires

Traditional solar cell production process Key Takeaways Traditional solar cell production starts with silicon wafer manufacturing and proceeds through texturing, diffusion, gravure, coating and metallization. Wafer slicing quality — kerf, TTV and surface damage — directly affects cell efficiency and yield. Before we always described the manufacturing principle and processing process of silicon wafers, today we will describe the production process of traditional solar cells. Traditional cell production can be mainly summarized into 6 steps. From the perspective of the traditional cell manufacturing process, it...

Août 2, 2022DéfautLire la suite...

L’essor des plaquettes de silicium dans l’industrie photovoltaïque

The boom of silicon wafers in the photovoltaic industry Key Takeaways Carbon-neutrality goals worldwide have made photovoltaics the fastest-growing source of demand for silicon wafers. PV wafer economics are driven by kerf loss and throughput, which is the main reason diamond wire replaced slurry saws across the industry. Larger wafer formats and thinner wafers are the PV industry's structural cost-reduction path, and both raise the bar for cutting precision. Dans le contexte de l’objectif de neutralisation des émissions de carbone et de l’application accélérée de l’énergie propre à l’échelle mondiale,...

Juillet 22, 2022DéfautLire la suite...
22071902

2022 Vue d’ensemble de l’industrie des plaquettes de semi-conducteurs

2022 Aperçu de l'industrie des plaquettes semi-conductrices Points clés Les plaquettes de silicium semi-conductrices sont le substrat porteur pour la fabrication de puces, and the wafer industry is highly concentrated and technology-intensive. Industry development is driven by larger wafer diameters, tighter flatness specs and growing demand from logic, memory and power devices. Semiconductor silicon wafer is the carrier for manufacturing chips, also known as silicon wafer because the raw material is silicon. After planning and management-free silicon refining, purification, monocrystalline silicon production, wafer forming and other processes, it can enter the...

Juillet 19, 2022DéfautLire la suite...

Diamond Wire Silicon Wafer Cutting Equipment Trends

1) High line speed and high production capacity support the reduction of single GW investment According to the theory of fracture mechanics and the properties of silicon materials, when the maximum cutting depth of diamond abrasive grains is greater than the critical cutting depth of silicon materials, the transition from plastic cutting to brittle fracture cutting will occur. Donc, within the allowable range of the diamond wire load, appropriately increasing the steel wire speed in the multi-wire cutting process is beneficial...

Juin 16, 2022DéfautLire la suite...

Changement dimensionnel des plaquettes de silicium photovoltaïque

Key Takeaways Photovoltaic silicon wafer sizes evolved from semiconductor wafer formats, with PV historically lagging semiconductors in dimension standards. Wafer dimensions keep growing (from 156 mm to 182/210 mm classes) because larger wafers cut module cost per watt. Larger and thinner wafers raise the precision bar for slicing equipment and diamond wire. La taille des plaquettes de silicium photovoltaïques est dérivée des plaquettes de silicium semi-conductrices. En termes de développement , photovoltaics lag behind semiconductors by 1 À 2 generations. Au fil des années, the size of...

Juin 2, 2022DéfautLire la suite...

Silicon Ingot Processing in Semiconductor Industry

Key Takeaways In semiconductor wafer preparation, single-crystal silicon ingots are processed into bare wafers with high surface accuracy for lithography. The ingot processing flow includes cropping, broyage, Trancher, Chanfreinage, lapping and polishing, with slicing quality setting downstream workload. À l’étape de préparation de la plaquette de silicium monocristallin, the silicon ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy and surface quality to prepare for planarization for lithography and other processes in the first half of the IC process. Ultra-smooth...

Mai 27, 2022DéfautLire la suite...