Inadimplência

General articles and updates from Ensoll Tools.

Aplicações de Wafers de Carbeto de Silício & Tendências

Aplicação de wafers de carbeto de silício e tendência futura de desenvolvimento Principais conclusões O carbeto de silício é a principal direcção de desenvolvimento da indústria de semicondutores de potência. SiC wafers enable devices that run at higher voltage, frequency and temperature than silicon, cutting energy losses in EVs, fast charging and grid equipment. The industry trend is toward larger SiC wafer diameters and lower defect densities. Carboneto de silício (Sic) é a principal direção de desenvolvimento da indústria de semicondutores de potência, and its use in the manufacture of power devices can significantly improve power...

Como processar carboneto de silício?

Como processar carboneto de silício? Principais Conclusões O carboneto de silício é o material-chave da indústria de semicondutores de potência, but its hardness makes every processing step demanding. SiC processing flows from crystal growth through slicing, grinding and polishing, with diamond-based tooling used at each hard-material step. Carboneto de silício (Sic) Material é a principal direção de desenvolvimento da indústria de semicondutores de potência. It is used to make power devices and can significantly improve the utilization rate of electric energy. In the foreseeable future, new energy vehicles will...

Fio de diamante serra cortada ímã NdFeB

Diamond wire loop saw cutting NdFeB magnet Key Takeaways NdFeB magnets are tetragonal Nd2Fe14B crystals — the strongest commercial permanent magnets in use today and the most common rare-earth magnet across electronics, motores, medical equipment and aerospace. There are two types: bonded NdFeB, which is magnetically isotropic and corrosion-resistant, and sintered NdFeB, which is stronger but corrodes easily and must be plated (zinc, nickel, or nickel-copper-nickel coatings). Traditional cutting routes are reciprocating long-wire saws for large magnets and inner-diameter (ID) slicing machines for small...

Processo tradicional de produção de células solares

Traditional solar cell production process Key Takeaways Traditional solar cell production starts with silicon wafer manufacturing and proceeds through texturing, difusão, etching, coating and metallization. Wafer slicing quality — kerf, TTV and surface damage — directly affects cell efficiency and yield. Before we always described the manufacturing principle and processing process of silicon wafers, today we will describe the production process of traditional solar cells. Traditional cell production can be mainly summarized into 6 steps. From the perspective of the traditional cell manufacturing process, it...

O boom dos wafers de silício na indústria fotovoltaica

The boom of silicon wafers in the photovoltaic industry Key Takeaways Carbon-neutrality goals worldwide have made photovoltaics the fastest-growing source of demand for silicon wafers. PV wafer economics are driven by kerf loss and throughput, which is the main reason diamond wire replaced slurry saws across the industry. Larger wafer formats and thinner wafers are the PV industry's structural cost-reduction path, and both raise the bar for cutting precision. Under the background of the carbon neutralization goal and the accelerated application of global clean energy,...

2022 Visão geral da indústria de wafer semicondutor

2022 Visão Geral da Indústria de Pastilhas de Semicondutores Principais Conclusões As pastilhas de silício para semicondutores são o substrato transportador para a fabricação de chips, and the wafer industry is highly concentrated and technology-intensive. Industry development is driven by larger wafer diameters, tighter flatness specs and growing demand from logic, memory and power devices. Semiconductor silicon wafer is the carrier for manufacturing chips, also known as silicon wafer because the raw material is silicon. After planning and management-free silicon refining, purification, monocrystalline silicon production, wafer forming and other processes, it can enter the...

Diamond Wire Silicon Wafer Cutting Equipment Trends

1) High line speed and high production capacity support the reduction of single GW investment According to the theory of fracture mechanics and the properties of silicon materials, when the maximum cutting depth of diamond abrasive grains is greater than the critical cutting depth of silicon materials, the transition from plastic cutting to brittle fracture cutting will occur. Portanto, within the allowable range of the diamond wire load, appropriately increasing the steel wire speed in the multi-wire cutting process is beneficial...

Mudança dimensional de wafers de silício fotovoltaico

Principais Conclusões Os tamanhos das pastilhas de silício fotovoltaico evoluíram a partir dos formatos de pastilhas de semicondutor, com a PV historicamente a ficar atrás dos semicondutores em padrões de dimensão. As dimensões das pastilhas continuam a crescer (de 156 mm para 182/210 classes mm) porque pastilhas maiores reduzem o custo por watt do módulo. Pastilhas maiores e mais finas aumentam o nível de precisão necessário para equipamentos de corte e fio de diamante. O tamanho dos wafers de silício fotovoltaico é derivado de wafers de silício semicondutor. Em termos de desenvolvimento , o setor fotovoltaico fica atrás dos semicondutores por 1 Para 2 gerações. Ao longo dos anos, o tamanho de...