Flux de traitement d'ingot de silicium monocristallin
Points clés À partir d'un lingot de silicium monocristallin, on passe par le découpage, rectification du diamètre, Trancher, chanfreinage des bords, lapping and polishing before it is ready for lithography. Surface accuracy at the slicing stage determines how much downstream planarization work is required. Diamond wire slicing is the standard way to turn an ingot into bare wafers with tight thickness variation and low sub-surface damage. À l’étape de préparation de la plaquette de silicium monocristallin, the silicon single-crystal ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy...
