Silicon cutting machines and diamond wire solutions for cropping and slicing monocrystalline and polycrystalline silicon ingots, wafers and rods — low kerf loss, low surface damage and high throughput for photovoltaic and semiconductor production.
-
ESC600-4TDiamond Wire Saw Cutting Machine
Main drive motor power: 2kW
Total weight: 3500 kg.
Overall dimensions: 3800mm * 3000mm * 2800 mm
Cutting range: Within 2000mm x 600mm x 600mm (length x width x height)
Displacement servo motor…










