Quais são as vantagens do corte de laço de fio diamantado?

A tecnologia de corte Diamond-Wire-loop é uma tecnologia de corte avançada para substituir o tradicional corte livre de argamassa, que é amplamente utilizado no campo do corte de wafer de silício nas indústrias fotovoltaica e de semicondutores.

Seu processo de desenvolvimento é o seguinte:

Phase One: The Era of Free Abrasive Slurry Cutting Monopoly

Prior to the maturation of diamond wire technology, the cutting of solar cells and semiconductor silicon wafers predominantly relied on Free Abrasive Slurry Cutting (FASC). This method involved high-speed steel wires carrying a slurry—a mixture of abrasives like silicon carbide or zirconium corundum with polyethylene glycol—to slice silicon ingots through a “three-body abrasion” mechanism.

Contudo, this technique presented significant drawbacks:

• Low Efficiency and High Material Loss: The cutting speed was slow, and the resulting kerf was wide (typically exceeding 200 microns), leading to the waste of over 40% of the expensive silicon material during the process.
• Severe Pollution and High Costs: It generated large volumes of waste slurry that were difficult to handle, incurring high subsequent cleaning and disposal costs.
• Deep Surface Damage: The uncontrolled cutting process often caused deep damage layers on and beneath the wafer surface, adversely affecting further processing and the performance of the final solar cells.

 

Phase Two: Pioneering Application of Diamond Wire by Japanese Enterprises

Japanese companies, notably Asahi Diamond Industrial Co., Ltd. and Nakamura Choukou Co., Ltd., achieved a technological breakthrough. They employed an electroplating process to firmly “plant” micron-sized diamond particles onto high-strength steel wire substrates, creating a diamond wire with “fixed abrasives.”

 

The fundamental cutting mechanism shifted from “three-body abrasion” Para “two-body abrasion”: the diamond particles, acting as fixed cutting edges, directly engaged with the material without rolling. This innovation increased cutting efficiency severalfold compared to the free abrasive method. In the early 2000s, this technology was primarily used for precision cutting of high-value, duros, and brittle materials like sapphire and optical glass. The wires were relatively thick and represented a specialized, high-end tool.

 

Phase Three: The Breakthrough of Thinner Wires and the Dawn of Photovoltaic Application

As the photovoltaic (PV) industry’s demand for cost reduction grew more urgent, the sector recognized that “wire diameter directly determines silicon material loss.” To achieve narrower kerfs and increase yield (more wafers per kilogram of silicon ingot), “thinner wire” development became the core focus of technological advancement.

 

Japanese companies continued to lead this progression, gradually reducing the diamond wire diameter from initial hundreds of microns to 17.5mm and even 14.5mm levels. Each reduction in diameter demanded more precise electroplating techniques and stronger wire substrates. This phase marked the expansion of diamond wire technology from niche applications like sapphire cutting into the realm of large-scale PV silicon wafer slicing, demonstrating immense potential for cost reduction.

Phase Four: The Rise of Chinese Enterprises and Global Industrial Adoption

Although the technology originated in Japan, the widespread global adoption and significant cost reduction of diamond wire cutting in the PV industry were primarily driven by Chinese enterprises. Companies such as Diamond Wire Technology Co., Ltd. and DaLee New Materials Co., Ltd. achieved key technological breakthroughs and scaled up production in the mid-to-late 2010s.

 

The contributions of Chinese manufacturers are mainly reflected in:

• Scale and Cost: Through massive capacity expansion and technological optimization, they brought down the high cost of diamond wire to a level widely acceptable for the PV industry.
• Technological Advancement: They persistently drove the “thinner wire” competition, pushing the mainstream diameter to 80μm, 60μm, and currently to the mass-produced 35μm level, drastically reducing silicon material costs.
• Process Integration: Through close collaboration with major Chinese wafer manufacturers (por exemplo,, LONGi, TCL Zhonghuan), they jointly perfected the complete set of cutting processes, establishing it as the industry standard.

 

The market landscape was consequently transformed. Por 2017, diamond wire cutting had completely replaced slurry cutting, becoming the mainstream process for crystalline silicon wafering, with a penetration rate exceeding 95%. Today, China holds the vast majority of the global diamond wire production capacity. Além disso, it is propelling the application of this technology into broader semiconductor and precision machining fields, including silicon carbide, safira, e materiais magnéticos.

As vantagens de laço de fio de diamante o corte inclui principalmente—— Velocidade de corte, Alta eficiência, high productivity.

Maior precisão e menor camada de dano, perda de material e queimadura ao cortar chapas finas, que é propício para cortar wafers de silício mais finos ou outras matérias-primas de alto valor.

Controle de qualidade, baixo custo por peça.

O uso de fluido de moagem à base de água é propício para melhorar o ambiente de trabalho e simplificar os procedimentos de pós-processamento, como limpeza, que é simples e ecologicamente correto.

Portanto, O corte de laço de diamante tornou-se o processo de corte convencional para fatiamento de silício cristalino na indústria fotovoltaica. Desde 2015, Ensolltools Technology Co., Ltd. começou a cultivar profundamente o campo de corte de serra de fio diamantado, A competitividade do produto continua a melhorar, e a participação de mercado aumenta ano a ano.

Em termos de laço de diamante, A empresa continua a liderar o setor em multas, rompeu as barreiras técnicas do laço do diamante de 0.3mm, e desenvolver ativamente reservas e produção experimental de loop de diamante de diâmetro mais fino, Com o equipamento de corte de laço de diamante Desenvolvido por nós, O diâmetro do fio mais fino ajuda a reduzir a perda de corte de matérias-primas, materiais especialmente raros e valiosos, ao mesmo tempo em que melhora a precisão e a eficiência do corte. Reduza o consumo de energia de corte.