В чем преимущества резки алмазной проволокой?

Технология резки с алмазной проволокой - это передовая технология резки, заменяющая традиционную резку свободного раствора, который широко используется в области резки кремниевых пластин в фотоэлектрической и полупроводниковой промышленности.

Процесс его разработки выглядит следующим образом:

Phase One: The Era of Free Abrasive Slurry Cutting Monopoly

Prior to the maturation of diamond wire technology, the cutting of solar cells and semiconductor silicon wafers predominantly relied on Free Abrasive Slurry Cutting (FASC). This method involved high-speed steel wires carrying a slurry—a mixture of abrasives like silicon carbide or zirconium corundum with polyethylene glycol—to slice silicon ingots through a “three-body abrasion” mechanism.

тем не мение, this technique presented significant drawbacks:

• Low Efficiency and High Material Loss: The cutting speed was slow, and the resulting kerf was wide (typically exceeding 200 microns), leading to the waste of over 40% of the expensive silicon material during the process.
• Severe Pollution and High Costs: It generated large volumes of waste slurry that were difficult to handle, incurring high subsequent cleaning and disposal costs.
• Deep Surface Damage: The uncontrolled cutting process often caused deep damage layers on and beneath the wafer surface, adversely affecting further processing and the performance of the final solar cells.

 

Phase Two: Pioneering Application of Diamond Wire by Japanese Enterprises

Japanese companies, notably Asahi Diamond Industrial Co., ООО. and Nakamura Choukou Co., ООО, achieved a technological breakthrough. They employed an electroplating process to firmly “plant” micron-sized diamond particles onto high-strength steel wire substrates, creating a diamond wire with “fixed abrasives.”

 

The fundamental cutting mechanism shifted from “three-body abrasion” к “two-body abrasion”: the diamond particles, acting as fixed cutting edges, directly engaged with the material without rolling. This innovation increased cutting efficiency severalfold compared to the free abrasive method. In the early 2000s, this technology was primarily used for precision cutting of high-value, hard, and brittle materials like sapphire and optical glass. The wires were relatively thick and represented a specialized, high-end tool.

 

Phase Three: The Breakthrough of Thinner Wires and the Dawn of Photovoltaic Application

As the photovoltaic (ПВ) industry’s demand for cost reduction grew more urgent, the sector recognized that “wire diameter directly determines silicon material loss.” To achieve narrower kerfs and increase yield (more wafers per kilogram of silicon ingot), “thinner wire” development became the core focus of technological advancement.

 

Japanese companies continued to lead this progression, gradually reducing the diamond wire diameter from initial hundreds of microns to 17.5mm and even 14.5mm levels. Each reduction in diameter demanded more precise electroplating techniques and stronger wire substrates. This phase marked the expansion of diamond wire technology from niche applications like sapphire cutting into the realm of large-scale PV silicon wafer slicing, demonstrating immense potential for cost reduction.

Phase Four: The Rise of Chinese Enterprises and Global Industrial Adoption

Although the technology originated in Japan, the widespread global adoption and significant cost reduction of diamond wire cutting in the PV industry were primarily driven by Chinese enterprises. Companies such as Diamond Wire Technology Co., ООО. and DaLee New Materials Co., ООО. achieved key technological breakthroughs and scaled up production in the mid-to-late 2010s.

 

The contributions of Chinese manufacturers are mainly reflected in:

• Scale and Cost: Through massive capacity expansion and technological optimization, they brought down the high cost of diamond wire to a level widely acceptable for the PV industry.
• Technological Advancement: They persistently drove the “thinner wire” competition, pushing the mainstream diameter to 80μm, 60мкм, and currently to the mass-produced 35μm level, drastically reducing silicon material costs.
• Process Integration: Through close collaboration with major Chinese wafer manufacturers (например., ЛОНГи, TCL Zhonghuan), they jointly perfected the complete set of cutting processes, establishing it as the industry standard.

 

The market landscape was consequently transformed. Около 2017, diamond wire cutting had completely replaced slurry cutting, becoming the mainstream process for crystalline silicon wafering, with a penetration rate exceeding 95%. Сегодня, China holds the vast majority of the global diamond wire production capacity. Кроме того, it is propelling the application of this technology into broader semiconductor and precision machining fields, в том числе карбид кремния, сапфир, and magnetic materials.

Преимущества алмазная проволочная петля Резка в основном включает в себя——Скорость резания, Высокая эффективность, high productivity.

Более высокая точность и меньший уровень повреждений, Потеря материала и пригар при резке тонких листов, что способствует резке более тонких кремниевых пластин или другого ценного сырья.

Контроль качества, низкая стоимость за штуку.

Использование шлифовальной жидкости на водной основе способствует улучшению рабочей среды и упрощению процедур постобработки, таких как очистка, который прост и экологичен.

Поэтому, Алмазная кольцевая резка стала основным процессом резки кристаллического кремния в фотоэлектрической промышленности. С 2015, Ensolltools Technology Co., ООО. начал глубоко культивировать область алмазной резки канатной пилой, Конкурентоспособность продукции продолжает расти, и доля рынка растет с каждым годом.

С точки зрения ромбовидной петли, Компания продолжает лидировать в отрасли по штрафованию, преодолел технические барьеры алмазной петли диаметром 0,3 мм, активно разрабатывать запасы и опытно-промышленную эксплуатацию алмазной петли более мелкого диаметра, С помощью Оборудование для резки алмазных петель Разработано нами, Более тонкий диаметр проволоки помогает снизить потери сырья при резке, особо редкие и ценные материалы, при одновременном повышении точности и эффективности резки. Снижение энергопотребления резки.