Epoxidharz-Präzisionsschneiden mit Diamantdrahtschleife: 2 mm-Testdaten
Sample testing for a European client (Company Q) · Ring diamond wire cutting process
Überblick
This report documents precision slicing of epoxy resin using a ring diamond wire cutting system. The evaluation covers equipment and wire selection, cutting methodology, process parameters, and the resulting thickness uniformity, Maßgenauigkeit, surface quality and edge integrity of the sliced parts. Test results indicate that a gantry-type ring diamond wire machine, water-based cooling, and appropriately matched process parameters deliver stable, high-precision slicing of epoxy resin.
1. Test Specimen
| Parameter | Wert |
|---|---|
| Material | Epoxy resin |
| Härte | approx. 5–6 Mohs |
| Werkstückabmessungen | 30.0 mm (L) × Ø20.0 mm |
| Target slice dimensions | 2.0 mm (L) × Ø20.0 mm |
2. Equipment and Wire Selection
Equipment: ESO-GM. In view of the material characteristics of epoxy resin and the requirement to produce 2 mm thin slices, Ensoll selected the ESO-GM gantry-type ring diamond wire cutting system with a top-down vertical feed. The gantry configuration maintains a stable wire trajectory and slice thickness accuracy, and the machine is equipped with a mist-extraction system.
Kühlmittel: water-based cutting. Water is used as the cooling medium. It continuously cools the contact zone between the diamond wire and the epoxy resin and carries away part of the heat and cutting debris generated during cutting, reducing the effect of localised temperature rise and debris accumulation on the machining condition. Controlled water supply helps maintain a stable cutting zone.
Draht: fully plated. A fully plated diamond wire was selected. Die plattierte Konstruktion verbessert die Bindungsfestigkeit zwischen den Diamantkörnern und dem Drahtkern und sorgt für eine gleichmäßigere Kornverteilung, so the wire maintains a consistent grinding capability and material removal behaviour during cutting. This reduces grain pull-out and wire wear. For the 2 mm thin-slice requirement in epoxy resin, stable wire performance is essential to thickness consistency.
3. Schneidverfahren und Gerätevorteile
Portal-Schneidkonfiguration. Die Portalkonstruktion bietet eine hohe Gesamtsteifigkeit und Laufruhe. The top-down vertical feed helps keep the diamond wire trajectory stable and reduces the influence of changes in cutting force on slice position and dimensional accuracy in epoxy resin. The machine is equipped with a mist-extraction system that promptly removes mist generated during water-based cutting.
Intelligente Spannungsregelung. Das System passt die Spannung des Diamantdrahts in Echtzeit an die Schneidbedingungen an und unterstützt sowohl Konstantspannungs- als auch Variabelspannungsmodi, hält das Drahtlaufen stabil. Well-matched tension control reduces fluctuation in the wire trajectory and limits localised uneven loading and the risk of wire breakage caused by tension variation, which in turn reduces the occurrence of slice defects.
Drahtbruchspeicher. Wenn der Diamantdraht reißt oder die Maschine abnormal stoppt, Das System zeichnet automatisch die aktuelle Bearbeitungsposition und den zugehörigen Betriebszustand auf. Nach dem Drahtwechsel, cutting resumes from the recorded position, reducing dimensional deviation and material loss caused by re-positioning and repeat machining. This improves the continuity of epoxy resin thin-slice cutting and lowers the risk of repeated cutting.
Hochsteifes einteiliges Graugussgestell. The one-piece cast iron frame provides high structural stiffness and vibration resistance, reducing the effect of machine vibration and structural deformation on the wire trajectory during machining. For the cutting stability and thickness consistency demanded by 2 mm epoxy resin slices, the high-rigidity frame helps damp vibration during the cut and keeps the wire running steadily.
4. Prozessparameter und Kühlmethode
| Parameter | Wert |
|---|---|
| Drahtdurchmesser (mm) | 0.35 × 1978 |
| Drahtvorschubgeschwindigkeit (mm/min) | 8 |
| Schnittbreite (mm) | 20 |
| Drahtspannung (N) | 80 |
| Drahtgeschwindigkeit (m/s) | 21 |
| Drahtbogenzeit (s) | 60 |
5. Schneidleistung und Ergebnisse
5.1 TTV-Testdaten (Einheit: mm)
Gesamt-Dickenvariation (TTV) wurde mithilfe eines Neun-Punkte-Rasters gemessen, dual-probe thickness gauging method on a vacuum-chuck stage. The measurement was applied to epoxy resin slices produced by ring diamond wire cutting. Before measurement the instrument was thermally stabilised and calibrated against a standard thickness block. Die nominelle Scheibendicke betrug 2.000 mm.
| Probe | Neun-Punkte-Stärkemessungen | TMax | TMin | TTV |
|---|---|---|---|---|
| S01 | 1.994, 1.997, 2.000 1.996, 2.001, 2.004 1.998, 2.005, 2.008 |
2.008 | 1.994 | 0.014 |
| S02 | 1.990, 1.994, 1.998 1.995, 2.000, 2.003 1.997, 2.004, 2.007 |
2.007 | 1.990 | 0.017 |
| S03 | 1.986, 1.991, 1.995 1.993, 1.998, 2.002 1.996, 2.003, 2.009 |
2.009 | 1.986 | 0.023 |
| S04 | 1.995, 1.998, 2.001 1.997, 2.002, 2.005 1.999, 2.006, 2.010 |
2.010 | 1.995 | 0.015 |
| S05 | 1.992, 1.996, 1.999 1.994, 2.000, 2.004 1.998, 2.005, 2.009 |
2.009 | 1.992 | 0.017 |
| S06 | 1.988, 1.993, 1.997 1.994, 1.999, 2.003 1.996, 2.004, 2.008 |
2.008 | 1.988 | 0.020 |
Bewertung. Nine-point grid measurement was applied to six epoxy resin slices. TTV values were 0.014, 0.017, 0.023, 0.015, 0.017 und 0.020 mm, spanning 0.014–0.023 mm across the batch, with a mean TTV of approximately 0.018 mm bei einem 2.000 mm Nennstärke. The results confirm good thickness uniformity in epoxy resin slicing.
5.2 Dicken-Toleranz-Daten (Einheit: mm)
Thickness tolerance was derived from the nine-point thickness data, Verwendet 2.000 mm wie die Nenndicke. The positive and negative thickness deviation were calculated at each measurement position and the results from all six samples were aggregated. The maximum positive deviation, maximum negative deviation and overall deviation range were determined to evaluate thickness consistency.
| Probe | Mittlere Dicke | Dickenabweichung |
|---|---|---|
| S01 | 2.000 | 0.000 |
| S02 | 1.999 | −0.001 |
| S03 | 1.997 | −0.003 |
| S04 | 2.001 | +0.001 |
| S05 | 2.000 | 0.000 |
| S06 | 1.998 | −0.002 |
| Maximale positive Abweichung | — | +0.010 mm |
| Maximale negative Abweichung | — | −0.014 mm |
| Dicken-Toleranzbereich | — | ±0.012 mm |
Bewertung. Gegenüber einer nominalen Dicke von 2.000 mm, the six slices showed mean thicknesses of 1.997–2.001 mm, with the batch average close to nominal. Over all measurement points the thickness deviation ranged from −0.014 mm to +0.010 mm, with a maximum absolute deviation of 0.014 mm.
5.3 Oberflächenrauheit Ra-Daten (Einheit: μm)
Oberflächenrauheit (Ra) was measured by stylus profilometry on the epoxy resin slices after ring diamond wire cutting. Representative measurement positions were taken at the centre and on both sides along the cut end face, surface profile data was acquired with a stylus profilometer, and the roughness parameter Ra was recorded at each position.
| Probe | Centre | Mid-left | Mid-right | Mittlerer Ra |
|---|---|---|---|---|
| S01 | 0.62 | 0.68 | 0.65 | 0.65 |
| S02 | 0.58 | 0.63 | 0.60 | 0.60 |
| S03 | 0.72 | 0.78 | 0.75 | 0.75 |
| S04 | 0.55 | 0.61 | 0.58 | 0.58 |
| S05 | 0.65 | 0.70 | 0.67 | 0.67 |
| S06 | 0.60 | 0.66 | 0.63 | 0.63 |
Bewertung. Mean Ra across the six samples ranged from 0.58 An 0.75 μm, mit allen einzelnen Messwerten zwischen 0.55 und 0.78 μm. The narrow spread across the three measurement positions on each slice indicates a uniform surface finish along the cut face.
5.4 Edge Chipping Data (Einheit: μm)
Edge chipping was quantified by optical imaging on a toolmaker’s microscope. Specimen edges were cleaned before measurement and the magnification and measurement scale of the instrument were calibrated. The slice edge was then inspected under the microscope, identifiable chipping defects were located and measured at four points per sample, and the maximum value was retained.
| Probe | Point 1 | Point 2 | Point 3 | Point 4 | Max. Absplitterungen |
|---|---|---|---|---|---|
| S01 | 4.2 | 4.8 | 5.3 | 4.6 | 5.3 |
| S02 | 3.8 | 4.5 | 4.9 | 4.2 | 4.9 |
| S03 | 5.6 | 6.3 | 7.2 | 6.5 | 7.2 |
| S04 | 3.5 | 4.1 | 4.6 | 3.9 | 4.6 |
| S05 | 4.8 | 5.4 | 6.1 | 5.2 | 6.1 |
| S06 | 4.3 | 5.0 | 5.6 | 4.7 | 5.6 |
Bewertung. Toolmaker’s microscope inspection of the six epoxy resin slices gave maximum chipping values of 5.3, 4.9, 7.2, 4.6, 6.1 und 5.6 μm, with an overall maximum of 7.2 μm. S04 showed the best edge integrity, and S03 the largest chipping at 7.2 μm.
6. Schlussfolgerung
The good results obtained in this high-precision slicing trial of epoxy resin stemmed mainly from the combined effect of a purpose-built cutting machine, the cooling method, and correctly matched process parameters. Epoxy resin is a polymer material, and its machining behaviour depends on the resin formulation and cure state. During ring diamond wire cutting the material is acted on continuously by the abrasive grains, and cutting load, wire condition and process parameters together govern the quality of the slice.
Equipment. An ESO-GM ring diamond wire cutting system was used. The machine provides good overall structural rigidity and running stability and gives reliable mechanical support for workpiece clamping and continuous wire travel. Coordinated control of the feed mechanism and wire running condition keeps the diamond wire on the programmed path throughout the cut.
Kühlung. Water-based cutting was adopted. Continuous grinding generates friction heat in the cutting zone, and localised temperature rise can affect the machining state of the material. Continuous water supply cools the contact area between the wire and the workpiece, carries away part of the cutting debris, and reduces the effect of localised heat accumulation on the material surface.
Process parameters. Drahtgeschwindigkeit, feed rate and other key parameters were matched to the properties of epoxy resin and to the target slice thickness. Parameters were set to maintain stable wire travel and continuous material removal, avoiding feed rates high enough to raise localised cutting load, or a parameter mismatch that would degrade slice quality.
Insgesamt. Taken together with slice dimensional accuracy, Dickenabweichung, Oberflächenrauheit (Ra) and cut-edge quality, the combination of the ESO-GM ring diamond wire machine, water-based cutting and appropriately matched process parameters provides stable material removal and effective slice quality control for epoxy resin.
