Scie à fil diamanté annulaire pour la découpe des céramiques

Actuellement, Les processus de sciage et de coupe des matériaux durs et cassants sont en proie à des problèmes tels que la faible efficacité de traitement, faible rendement en matière, mauvaise qualité et intégrité de la surface, Coûts d’outillage élevés, et la pollution de l’environnement. When using circular saws to cut materials like stone and céramique, Les lames de scie doivent posséder une certaine épaisseur pour assurer la rigidité. Il en résulte des traits de scie larges, faible rendement en matière, et une pollution importante. De plus, Les scies circulaires ne sont pas en mesure d’effectuer l’usinage de surface façonnée, leading to inferior surface quality when cutting ceramic materials. In the semiconductor industry, the use of free abrasive wire cutting methods to process silicon crystals results in significant surface and environmental contamination by diamond abrasive slurry, thereby increasing the costs associated with subsequent processing and waste treatment.

Scie à fil diamanté is a hard and brittle material cutting method that has experienced rapid development in the past decade, primarily involving the use of free abrasive and bonded abrasive types. Based on the wire saw’s motion and machine structure, it can also be classified as reciprocating and unidirectional wire saws. Actuellement, reciprocating multi-wire saws using free abrasives dominate in the semiconductor and optoelectronic industries. To address issues such as low cutting speeds and abrasive slurry contamination, the diamond unidirectional wire saw utilizing bonded abrasives has been proposed. This type of wire saw features a simple structure, enables high-speed wire movement, and allows for shaping operations, thus holding significant practical importance in advancing equipment for processing hard and brittle materials. The bonded abrasive diamond annular wire saw offers the following advantages:

(1) Fente étroite, high material yield. By using high-strength steel wire as the base material, various wire saws with diameters below 1mm can be produced. Companies like Sumitomo Electric Industries and Lid in Japan have manufactured wire saws with average diameters ranging from 0.175 to 0.180mm using steel wires with diameters of 0.130 and 0.155mm as the base material, achieving an actual kerf loss of 0.19mm in sodium glass cutting experiments.

(2) Fast cutting speed, Rendement élevé. The bonded abrasive annular diamond wire saw features unidirectional movement of the wire saw during the cutting process, with the abrasive grains fixed on the wire saw, eliminating the difficulty of abrasive entry into long and deep kerfs. Compared to reciprocating structures and wire saws using free abrasives, it is easier to achieve higher cutting speeds, resulting in high processing efficiency.

(3) Smooth cutting process, good slice surface quality. During the cutting process with a diamond wire saw, the cutting force is small and gentle, without the unique grooves generated on the workpiece surface due to reciprocating wire saw movement.

(4) Minimal environmental pollution. Bonded abrasive diamond wire saws typically use water as the standard coolant, and dry cutting methods can even be employed at lower wire speeds. This results in low or no need for wastewater treatment due to the use of bonded abrasives.

En conclusion, in today’s increasingly widespread applications in non-conductive materials, semiconductor materials, et matériaux composites, the bonded abrasive diamond wire saw demonstrates unique advantages in cutting hard and brittle materials. Toutefois, current research and applications are insufficient, particularly in areas such as wire saw manufacturing technology, cutting processes and mechanisms, diamond wire saw failure modes and mechanisms, and wire saw posture and motion control technologies in precision shaping cutting. There are many significant gaps that warrant further exploration. This study aims to explore electroplated diamond wire saw cutting technology, deeply understand its cutting mechanisms, and promote the precise and efficient processing of hard and brittle materials, which holds important significance.
Annular saws suit certain shapes; for flat precision work the reference is découpe de précision de l'alumine.

Questions fréquemment posées

What is an annular diamond wire saw?

It is a bonded-abrasive wire saw in which diamond grains are fixed on a wire loop that moves unidirectionally at high speed. The simple structure allows high wire speeds and shaped cutting of hard, brittle materials such as ceramics — an alternative to reciprocating free-abrasive wire saws.

What advantages does a bonded-abrasive wire saw have over free-abrasive sawing?

Because the diamond grains are fixed on the wire, there is no abrasive slurry that must enter long, deep kerfs, so higher cutting speeds are achievable. It also produces a narrow kerf with high material yield, a smooth cut surface without reciprocating grooves, and far less contamination.

Quelle est la finesse de coupe d'une scie à fil diamanté?

Manufacturers such as Sumitomo Electric Industries and Lid in Japan have produced wire saws averaging 0.175-0.180 mm in diameter on steel cores of 0.130-0.155 mm, achieving an actual kerf loss of about 0.19 mm in sodium glass cutting experiments.

Is diamond wire sawing environmentally friendly?

Relatively yes. Bonded-abrasive diamond wire saws typically use plain water as coolant, and dry cutting is even possible at lower wire speeds. With no free-abrasive slurry, there is little or no wastewater treatment required — a major contrast with slurry-based silicon wafering.

Examiné par l'équipe d'ingénierie Ensoll.