デフォルト

General articles and updates from Ensoll Tools.

シリコンカーバイドウエハの応用 & トレンド

Silicon carbide wafer application and future development trend Key Takeaways Silicon carbide is the main development direction of the power semiconductor industry. SiC wafers enable devices that run at higher voltage, frequency and temperature than silicon, cutting energy losses in EVs, fast charging and grid equipment. The industry trend is toward larger SiC wafer diameters and lower defect densities. 炭化ケイ素 (ティッカー) パワー半導体産業の主な開発方向です, and its use in the manufacture of power devices can significantly improve...

8月 9, 2022デフォルト続きを読む...

Processing Silicon Carbide (ティッカー): Steps and Tools

How to process 炭化ケイ素? 最終レビュー: 9 月 2026 Key Takeaways Silicon carbide is the key material of the power semiconductor industry, but its hardness makes every processing step demanding. SiC processing flows from crystal growth through slicing, grinding and polishing, with diamond-based tooling used at each hard-material step. 炭化ケイ素 (ティッカー) 材料はパワー半導体産業の主な開発方向です. パワーデバイスの製造に使用され、電気エネルギーの利用率を大幅に向上させることができます. 近い将来,...

8月 5, 2022デフォルト続きを読む...

ダイヤモンドワイヤーループソーカットNdFeB磁石

Diamond wire loop saw cutting NdFeB magnet Key Takeaways NdFeB magnets are tetragonal Nd2Fe14B crystals — the strongest commercial permanent magnets in use today and the most common rare-earth magnet across electronics, motors, medical equipment and aerospace. There are two types: bonded NdFeB, which is magnetically isotropic and corrosion-resistant, and sintered NdFeB, which is stronger but corrodes easily and must be plated (zinc, ニッケル, or nickel-copper-nickel coatings). Traditional cutting routes are reciprocating long-wire saws for large magnets and inner-diameter (ID) slicing machines for small...

8月 5, 2022デフォルト続きを読む...

従来の太陽電池製造プロセス

Traditional solar cell production process Key Takeaways Traditional solar cell production starts with silicon wafer manufacturing and proceeds through texturing, 拡散, エッチング, coating and metallization. Wafer slicing quality — kerf, TTV and surface damage — directly affects cell efficiency and yield. Before we always described the manufacturing principle and processing process of silicon wafers, today we will describe the production process of traditional solar cells. Traditional cell production can be mainly summarized into 6 ステップス. 従来のセル製造プロセスの観点から,...

8月 2, 2022デフォルト続きを読む...

太陽光発電産業におけるシリコンウェーハのブーム

The boom of シリコンウエハ in the photovoltaic industry Key Takeaways Carbon-neutrality goals worldwide have made photovoltaics the fastest-growing source of demand for silicon wafers. PV wafer economics are driven by kerf loss and throughput, which is the main reason diamond wire replaced slurry saws across the industry. Larger wafer formats and thinner wafers are the PV industry's structural cost-reduction path, and both raise the bar for cutting precision. Under the background of the carbon neutralization goal and the accelerated application of global clean...

7 月 22, 2022デフォルト続きを読む...
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2022 半導体ウェーハ業界の概要

2022 半導体ウエハ産業の概要 重要ポイント 半導体シリコンウエハはチップ製造のためのキャリア基板である, and the wafer industry is highly concentrated and technology-intensive. Industry development is driven by larger wafer diameters, tighter flatness specs and growing demand from logic, memory and power devices. 半導体シリコンウェーハは、チップを製造するためのキャリアです, 原料がシリコンであることからシリコンウェーハとも呼ばれます. 計画と管理不要のシリコン精製後, 浄化, 単結晶シリコン production, ウェーハ成形およびその他のプロセス, it can enter...

7 月 19, 2022デフォルト続きを読む...

Diamond Wire Silicon Wafer Cutting Equipment Trends

1) High line speed and high production capacity support the reduction of single GW investment According to the theory of fracture mechanics and the properties of silicon materials, ダイヤモンド砥粒の最大切込みがシリコン材料の臨界切込みより大きい場合, 塑性切断から脆性破壊切断への移行が起こります. そこで, ダイヤモンド線荷重の許容範囲内, appropriately increasing the steel wire speed in the multi-wire cutting process is beneficial...

6月 16, 2022デフォルト続きを読む...

太陽光発電シリコンウェーハの寸法変化

Key Takeaways Photovoltaic silicon wafer sizes evolved from semiconductor wafer formats, with PV historically lagging semiconductors in dimension standards. Wafer dimensions keep growing (from 156 mm to 182/210 mm classes) because larger wafers cut module cost per watt. Larger and thinner wafers raise the precision bar for slicing equipment and diamond wire. 光起電力シリコンウェーハのサイズは、半導体シリコンウェーハに由来する. 開発の面で , 太陽光発電は半導体に遅れをとっている 1 宛先 2 世代. 何年にもわたって, the size of...

6月 2, 2022デフォルト続きを読む...