業界ニュース

Industry news and market insights on diamond wire cutting, precision machining and advanced materials.

PEEK slices cut by a diamond wire loop

ダイヤモンドワイヤーループによるPEEKの切断: 精密スライス試験

要約: This article presents a precision slicing test on PEEK (polyether ether ketone) using a diamond wire loop. The workpiece was a 200 mm × 60 mm × 60 mm PEEK block provided by European customer H, sliced into 6.5 mm-thick pieces on an Ensoll ESO-GM gantry-type diamond wire loop cutting machine. We report the equipment and wire selection, cutting parameters, cooling strategy, and quantitative quality metrics including Total Thickness Variation (TTV), thickness tolerance, 表面粗さ (Ra), and edge chipping....

9 月 4, 2026業界ニュース続きを読む...

エンドレスワイヤーソーによる磁性材料の輪郭切断

Ensoll tested a European customer magnetic-material sample with a customized endless diamond wire saw. The goal was to cut an irregular contour while keeping edge chipping, 表面粗さ, and contour deviation under control. The process used an endless diamond wire saw machine paired with a fully coated diamond wire loop. Key Takeaways A diamond wire loop process cut an irregular contour in an 80 x 50 x 50 mm magnetic-material sample, holding feature deviations within -0.110 / +0.073 ミリメートル. The matched setup was...

August 22, 2026業界ニュース続きを読む...
輪

ワイヤーソー用スチールガイドホイール vs ポリウレタンガイドホイール

Key Takeaways Steel guide wheels deliver maximum rigidity and dimensional stability for high-precision diamond wire cutting, but transmit more vibration to the wire. Polyurethane-coated guide wheels absorb vibration, run quieter and protect the diamond wire from metal-to-metal contact, extending wire life. The choice between steel and polyurethane wheels directly affects cutting precision, wire consumption and machine maintenance intervals. For hard, brittle materials where surface quality is critical, polyurethane wheels usually give the better balance of precision and wire economy. In the realm of diamond wire...

August 22, 2026業界ニュース続きを読む...
セミコーティングされたダイヤモンドループワイヤー

ダイヤモンドワイヤーループ: 新しい業界標準

In the universe of advanced manufacturing, the ability to slice through exceptionally hard and brittle substrates with sub-micron accuracy is a major competitive differentiator. As materials like Silicon Carbide, サファイア, and advanced industrial ceramics become foundational to 5G electronics, 電気自動車, and aerospace engineering, traditional cutting methods are reaching their physical limits.   The industry’s answer to this challenge is the diamond wire loop. Operating as the high-performance heart of modern cutting systems, this endless abrasive loop is reshaping how factories and...

August 22, 2026業界ニュース続きを読む...
Silicon Wafer Cutting

Endless Diamond Wire Loops for PV & Semiconductor

The global transition toward clean energy and advanced computing has placed unprecedented pressure on the supply chains of the photovoltaic (PV) solar and semiconductor industries. At the heart of both sectors lies a single, foundational material: high-purity silicon. Whether it is monocrystalline silicon grown for high-efficiency solar cells or ultra-pure silicon ingots destined for microchips, these crystals must be sliced into incredibly thin, flawless wafers before they can be processed into functional devices.   でも, silicon is notoriously brittle and expensive to...

August 22, 2026業界ニュース続きを読む...

光学ガラスを理解するための包括的なガイド

Key Takeaways Optical glass is engineered for lenses, prisms and filters with precisely controlled refractive index, dispersion and low impurity levels — a different material class from regular structural glass. Its defining characteristics are high transparency across a broad spectrum, controlled dispersion for correcting chromatic aberration, a low thermal expansion coefficient, and resistance to humidity and chemicals. The three main cutting routes compare clearly: ダイヤモンドワイヤー切断 (精度, thin kerf, clean edges), レーザー切断 (fast on thin glass but leaves a heat-affected zone),...

August 22, 2026業界ニュース続きを読む...