6월 4 고정밀 절단 기술 전시
ENSOLL과 함께 선전 신소재 전시회에서 차세대 다이아몬드 와이어쏘 절단 솔루션을 발견하세요!

As a professional one-stop solution provider for hard and brittle material processing, ENSOLL specializes in precision cutting of sapphire, 도예, 자성 재료, and semiconductor wafers. Our advanced equipment lineup is designed for high-efficiency, high-precision, and high-stability production environments
📍 Booth: 14G87
📅 Date: June 4–6, 2025
📌 Venue: 선전 국제 컨벤션 및 전시 센터(Shenzhen International Convention and Exhibition Center) (New Hall)
Let’s meet on-site to explore customized cutting solutions tailored to your industry need초!