다이아몬드 와이어 루프로 자성 재료 정밀 절단: 2 mm 테스트 데이터
유럽 고객을 위한 샘플 테스트 (Company P) · Ring diamond wire cutting process
개요
This report documents precision slicing of magnetic material using a ring diamond wire cutting system. 평가는 장비 및 와이어 선택을 포함한다, 절단 방법론, 공정 매개변수, 그 결과 두께 균일성, 치수 정확도, surface quality and edge integrity of the sliced parts. Test results indicate that a gantry-type ring diamond wire machine, 유성 냉각 및 윤활, and appropriately matched process parameters deliver stable, high-precision slicing of magnetic material.
1. 시험 시료
| 매개변수 | 값 |
|---|---|
| 재료 | Magnetic material |
| 경도 | 대략. 6–7 Mohs |
| 작업물 치수 | 60 mm × 26.0 mm × 3.0 밀리미터 |
| Target slice dimensions | 2.0 mm × 26.0 mm × 3.0 밀리미터 |
2. 장비 및 와이어 선택
장비: ESO-GM. In view of the hard-brittle characteristics of magnetic material and the requirement to slice at a 2 mm thickness, Ensoll selected the ESO-GM gantry-type ring diamond wire cutting system with a top-down vertical feed. The gantry configuration maintains a stable wire trajectory and slice dimensional accuracy.
냉각수: 유성 절단. 절삭유는 냉각 및 윤활 매체로 사용된다. It improves lubrication and heat dissipation in the contact zone between the diamond wire and the magnetic material, reduces friction resistance and localised heat accumulation during cutting, and limits fluctuation in cutting load and its effect on the material. 이것은 칩핑을 억제하는 데 도움이 됩니다., micro-cracking and surface damage.
와이어: 완전히 도금됨. 완전히 도금된 다이아몬드 와이어가 선택되었습니다.. 도금 구조는 다이아몬드 연마입자와 와이어 코어 사이의 결합 강도를 향상시키며 입자 분포를 보다 균일하게 만듭니다.. 이는 연속적이고 안정적인 재료 제거율을 유지합니다., 입자 탈락과 와이어 마모를 줄입니다., 그리고 칩핑을 낮추는 데 기여합니다., micro-cracking and surface damage when slicing magnetic material.
3. 절단 방식 및 장비 장점
Gantry cutting configuration. The gantry structure provides high overall rigidity and running stability. The top-down vertical feed helps keep the diamond wire trajectory stable and reduces the influence of changes in cutting force on kerf position and dimensional accuracy in the magnetic material. The machine is equipped with a mist-extraction system that promptly removes mist generated during cutting.
지능형 장력 제어. 이 시스템은 절단 조건에 따라 다이아몬드 와이어 장력을 실시간으로 조절하며, 일정 장력 모드와 가변 장력 모드를 모두 지원합니다., 와이어를 안정적으로 작동시키기. Stable wire tension reduces fluctuation in the cutting trajectory and limits localised uneven loading and the risk of wire breakage caused by tension variation, which in turn reduces defects in the magnetic material.
와이어 파단 메모리. 다이아몬드 와이어가 파손되거나 기계가 비정상적으로 정지하면, 시스템은 현재 가공 위치와 관련 작동 상태를 자동으로 기록합니다.. 와이어를 교체한 후, cutting resumes from the recorded position, reducing dimensional deviation and material loss caused by re-positioning and repeat machining. This improves the continuity of magnetic material slicing and lowers the risk of repeated cutting.
고강성 일체형 주철 프레임. The one-piece cast iron frame provides high structural stiffness and vibration resistance, reducing the effect of machine vibration and structural deformation on the wire trajectory during machining. For a hard-brittle material such as magnetic material, the high-rigidity frame helps damp vibration and fluctuation in cutting force during the cut and keeps the diamond wire running stably.
4. 공정 매개변수 및 냉각 방법
| 매개변수 | 값 |
|---|---|
| 와이어 직경 (밀리미터) | 0.35 × 1880 |
| 와이어 이동 속도 (mm / 분) | 2 |
| 절단 폭 (밀리미터) | 60 |
| 와이어 장력 (N) | 140 |
| 와이어 속도 (엠/초) | 26 |
| 와이어 보우 시간 (초) | 60 |
5. 절단 성능 및 결과
5.1 TTV 시험 데이터 (단위: 밀리미터)
총 두께 변동 (TTV) 9점 격자를 사용하여 측정됨, 진공 척 스테이지에서 이중 탐침 두께 측정 방법. The measurement was applied to magnetic material slices produced by ring diamond wire cutting. Before measurement the instrument was thermally stabilised and calibrated against a standard thickness block. The nominal slice thickness was 2.000 밀리미터.
| 시료 | 9점 두께 측정 | T최대 | T최소 | TTV |
|---|---|---|---|---|
| S01 | 1.992, 1.996, 1.998 1.995, 2.000, 2.003 1.997, 2.004, 2.006 |
2.006 | 1.992 | 0.014 |
| S02 | 1.988, 1.993, 1.997 1.995, 2.001, 2.004 1.999, 2.006, 2.008 |
2.008 | 1.988 | 0.020 |
| S03 | 1.985, 1.990, 1.994 1.992, 1.998, 2.002 1.996, 2.004, 2.009 |
2.009 | 1.985 | 0.024 |
| S04 | 1.994, 1.997, 2.000 1.996, 2.001, 2.004 1.999, 2.005, 2.007 |
2.007 | 1.994 | 0.013 |
| S05 | 1.989, 1.994, 1.997 1.993, 1.999, 2.003 1.996, 2.005, 2.010 |
2.010 | 1.989 | 0.021 |
평가. Nine-point grid measurement was applied to five magnetic material slices. TTV values were 0.014, 0.020, 0.024, 0.013 그리고 0.021 밀리미터, spanning 0.013–0.024 mm across the batch, with a mean TTV of approximately 0.018 mm 위에 2.000 mm 명목 두께. The results confirm good thickness uniformity in magnetic material slicing.
5.2 두께 허용치 데이터 (단위: 밀리미터)
Thickness tolerance was derived from the nine-point thickness data, using 2.000 mm as the nominal thickness. The positive and negative thickness deviation were calculated at each measurement position and the results from all five samples were aggregated. The maximum positive deviation, maximum negative deviation and overall deviation range were then determined to evaluate thickness consistency.
| 시료 | 평균 두께 | 두께 편차 |
|---|---|---|
| S01 | 1.999 | −0.001 |
| S02 | 1.999 | −0.001 |
| S03 | 1.997 | −0.003 |
| S04 | 2.000 | 0.000 |
| S05 | 1.998 | −0.002 |
| 최대 양의 편차 | — | +0.010 밀리미터 |
| 최대 음의 편차 | — | −0.015 mm |
| 두께 허용 범위 | — | ±0.0125 mm |
평가. 명목 두께에 대하여 2.000 밀리미터, the five slices showed mean thicknesses of 1.997–2.000 mm, with small average deviations across the batch. Over all measurement points the thickness deviation ranged from −0.015 mm to +0.010 밀리미터, with a maximum absolute deviation of 0.015 밀리미터.
5.3 Surface Roughness Ra Data (단위: μm의)
표면 거칠기 (Ra) was measured by stylus profilometry on the magnetic material slices after ring diamond wire cutting. Representative measurement positions were taken at the centre and on both sides along the cut end face, surface profile data was acquired with a stylus profilometer, and the roughness parameter Ra was recorded at each position.
| 시료 | Centre | Mid-left | Mid-right | Mean Ra |
|---|---|---|---|---|
| S01 | 0.52 | 0.56 | 0.49 | 0.52 |
| S02 | 0.48 | 0.53 | 0.50 | 0.50 |
| S03 | 0.61 | 0.66 | 0.58 | 0.62 |
| S04 | 0.46 | 0.51 | 0.48 | 0.48 |
| S05 | 0.55 | 0.59 | 0.53 | 0.56 |
평가. Mean Ra across the five samples ranged from 0.48 받는 사람 0.62 μm의, with all individual readings between 0.46 그리고 0.66 μm의. The narrow spread across the three measurement positions on each slice indicates a uniform surface finish along the cut face.
5.4 Edge Chipping Data (단위: μm의)
Edge chipping was quantified by optical imaging on a toolmaker’s microscope. Specimen edges were cleaned before measurement and the magnification and measurement scale of the instrument were calibrated. The slice edge was then inspected under the microscope, identifiable chipping defects were located and measured at four points per sample, and the maximum value was retained.
| 시료 | Point 1 | Point 2 | Point 3 | Point 4 | 최대. chipping |
|---|---|---|---|---|---|
| S01 | 4.2 | 5.1 | 4.8 | 5.6 | 5.6 |
| S02 | 3.8 | 4.6 | 5.2 | 4.4 | 5.2 |
| S03 | 5.6 | 6.8 | 7.5 | 6.2 | 7.5 |
| S04 | 3.5 | 4.1 | 4.6 | 3.9 | 4.6 |
| S05 | 4.9 | 5.7 | 6.3 | 5.2 | 6.3 |
평가. Toolmaker’s microscope inspection of the five magnetic material slices gave maximum chipping values of 5.6, 5.2, 7.5, 4.6 그리고 6.3 μm의, with an overall maximum of 7.5 μm의. S04 showed the best edge integrity and S03 the largest chipping at 7.5 μm의.
6. 결론
The good results obtained in this high-precision slicing trial of magnetic material stemmed mainly from the combined effect of a purpose-built cutting machine, 냉각 및 윤활 방법, 그리고 공정 매개변수의 정확한 일치. Magnetic material is relatively hard with a degree of brittleness. During ring diamond wire cutting the abrasive grains act continuously on the material surface, and material removal is affected by cutting load, wire running condition and the machining parameters.
장비. An ESO-GM gantry-type ring diamond wire cutting system was used. The gantry structure provides high overall rigidity and running stability and gives reliable mechanical support for workpiece clamping and continuous wire travel. Stable motion and feed control keep the diamond wire on the programmed path throughout the cut.
냉각 및 윤활. 절삭유가 냉각 및 윤활 매체로 사용되었다. During cutting the diamond wire remains in continuous contact with the workpiece and the abrasive grains grind the material continuously, 접촉 영역에서 마찰열을 발생시킴. Cutting oil improves lubrication at the cutting interface, carries away part of the cutting heat, and reduces friction between the wire and the workpiece, which helps limit thermal effects and edge damage.
공정 매개변수. 와이어 속도, feed rate and other key parameters were matched to the hardness, brittleness and target slice thickness of the magnetic material. 매개변수는 안정적인 와이어 이동과 연속적인 재료 제거를 유지하도록 설정되었으며, avoiding feed rates high enough to raise cutting load, or a mismatch between wire speed and feed rate that would degrade slice quality.
전체. Taken together with slice dimensional accuracy, thickness tolerance, 표면 거칠기 (Ra) and cut-edge quality, the combination of the ESO-GM gantry cutting machine, 유성 냉각 및 윤활, and appropriately matched process parameters allows ring diamond wire cutting to meet the precision slicing requirements for this magnetic material.
