单晶硅锭加工流程
Key Takeaways A single-crystal silicon ingot goes through cropping, diameter grinding, 切片, edge chamfering, lapping and polishing before it is ready for lithography. Surface accuracy at the slicing stage determines how much downstream planarization work is required. Diamond wire slicing is the standard way to turn an ingot into bare wafers with tight thickness variation and low sub-surface damage. 在单晶硅晶圆制备阶段, the silicon single-crystal ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy...
