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General articles and updates from Ensoll Tools.

Silicon Carbide Wafer Applications & Trends

Silicon carbide wafer application and future development trend Key Takeaways Silicon carbide is the main development direction of the power semiconductor industry. SiC wafers enable devices that run at higher voltage, frequency and temperature than silicon, cutting energy losses in EVs, fast charging and grid equipment. The industry trend is toward larger SiC wafer diameters and lower defect densities. Silicon carbide (SiC) is the main development direction of the power semiconductor industry, and its use in the manufacture of power devices can significantly improve power...

August 9, 2022DefaultRead more...

How to process silicon carbide?

How to process silicon carbide? Key Takeaways Silicon carbide is the key material of the power semiconductor industry, but its hardness makes every processing step demanding. SiC processing flows from crystal growth through slicing, grinding and polishing, with diamond-based tooling used at each hard-material step. Silicon carbide (SiC) material is the main development direction of the power semiconductor industry. It is used to make power devices and can significantly improve the utilization rate of electric energy. In the foreseeable future, new energy vehicles will...

August 5, 2022DefaultRead more...

Diamond wire loop saw cut NdFeB magnet

Diamond wire loop saw cutting NdFeB magnet Key Takeaways NdFeB magnets are tetragonal Nd2Fe14B crystals — the strongest commercial permanent magnets in use today and the most common rare-earth magnet across electronics, motors, medical equipment and aerospace. There are two types: bonded NdFeB, which is magnetically isotropic and corrosion-resistant, and sintered NdFeB, which is stronger but corrodes easily and must be plated (zinc, nickel, or nickel-copper-nickel coatings). Traditional cutting routes are reciprocating long-wire saws for large magnets and inner-diameter (ID) slicing machines for small...

August 5, 2022DefaultRead more...

Traditional solar cell production process

Traditional solar cell production process Key Takeaways Traditional solar cell production starts with silicon wafer manufacturing and proceeds through texturing, diffusion, etching, coating and metallization. Wafer slicing quality — kerf, TTV and surface damage — directly affects cell efficiency and yield. Before we always described the manufacturing principle and processing process of silicon wafers, today we will describe the production process of traditional solar cells. Traditional cell production can be mainly summarized into 6 steps. From the perspective of the traditional cell manufacturing process, it...

August 2, 2022DefaultRead more...

The boom of silicon wafers in the photovoltaic industry

The boom of silicon wafers in the photovoltaic industry Key Takeaways Carbon-neutrality goals worldwide have made photovoltaics the fastest-growing source of demand for silicon wafers. PV wafer economics are driven by kerf loss and throughput, which is the main reason diamond wire replaced slurry saws across the industry. Larger wafer formats and thinner wafers are the PV industry's structural cost-reduction path, and both raise the bar for cutting precision. Under the background of the carbon neutralization goal and the accelerated application of global clean energy,...

July 22, 2022DefaultRead more...
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2022 Semiconductor Wafer Industry Overview

2022 Semiconductor Wafer Industry Overview Key Takeaways Semiconductor silicon wafers are the carrier substrate for chip manufacturing, and the wafer industry is highly concentrated and technology-intensive. Industry development is driven by larger wafer diameters, tighter flatness specs and growing demand from logic, memory and power devices. Semiconductor silicon wafer is the carrier for manufacturing chips, also known as silicon wafer because the raw material is silicon. After planning and management-free silicon refining, purification, monocrystalline silicon production, wafer forming and other processes, it can enter the...

July 19, 2022DefaultRead more...

Diamond Wire Silicon Wafer Cutting Equipment Trends

1) High line speed and high production capacity support the reduction of single GW investment According to the theory of fracture mechanics and the properties of silicon materials, when the maximum cutting depth of diamond abrasive grains is greater than the critical cutting depth of silicon materials, the transition from plastic cutting to brittle fracture cutting will occur. Therefore, within the allowable range of the diamond wire load, appropriately increasing the steel wire speed in the multi-wire cutting process is beneficial...

June 16, 2022DefaultRead more...

Dimensional change of photovoltaic silicon wafers

Key Takeaways Photovoltaic silicon wafer sizes evolved from semiconductor wafer formats, with PV historically lagging semiconductors in dimension standards. Wafer dimensions keep growing (from 156 mm to 182/210 mm classes) because larger wafers cut module cost per watt. Larger and thinner wafers raise the precision bar for slicing equipment and diamond wire. The size of photovoltaic silicon wafers is derived from semiconductor silicon wafers. In terms of development , photovoltaics lag behind semiconductors by 1 to 2 generations. Over the years, the size of...

June 2, 2022DefaultRead more...