ニュース

Cutting Methods for Crystalline Silicon Ingots

クリーンエネルギーの急速な発展に伴い, 太陽光発電のグリッドパリティの目標も間近に迫っています. While various crystalline silicon manufacturers in the photovoltaic industry are continuously expanding their production capacity, they are also consistently reducing production costs, with the cutting of small silicon ingots being an important component of the cost of crystalline silicon solar cells. Key Takeaways Crystalline silicon ingots can be cut with inner-diameter blades, slurry wire saws or fixed diamond wire loops; diamond wire is...

Recycling Sapphire Kerf Waste: Research

Key Takeaways Sapphire wafers are about 0.2 mm thick — close to the diamond wire diameter — so roughly 40-50% of every ingot becomes cutting-waste powder washed away by coolant, and most of it has historically been landfilled. Analysis of washed, dried and sieved diamond-wire cutting waste shows alpha-alumina as the main component, with nickel (0.70%) and diamond (0.164%) as the main impurities. Ultrasound acid leaching beats conventional acid leaching for nickel removal: nickel falls to 0.009% at a 99.67% leaching ratio, そして。。.

Resin Hardness vs Diamond Wire Loop Performance

要約: この研究では、さまざまな樹脂バインダーがダイヤモンドワイヤーループの切断性能に与える影響を調査します. Resin-cured hardness samples were prepared using pure phenolic resin, epoxy-modified phenolic resin, and aromatic alkyl-modified phenolic resin, and their Rockwell hardness was tested. The fractured surfaces of the cured resin samples were observed using scanning electron microscopy, revealing varying levels of density post-curing. Diamond wire loops were then manufactured for single crystal silicon cutting experiments. The experimental results demonstrate that diamond wire loops...

KDP結晶に最適な切断方法

Introduction to KDP Crystals KDP crystals have a large nonlinear optical coefficient and a high laser damage threshold, making them important component materials in optical systems for high-energy engineering. KDP crystals belong to hard-to-process brittle materials, distinguishing them from traditional metal materials processing. Manufacturing Process of KDP Crystals The manufacturing process involves cutting into a rough shape and then a precision cut. Cutting is the first step in processing KDP crystal materials. Due to localized stress in the crystal blank, the entire crystal...

Cutting Fluid Impact on Diamond Wire Loop Quality

切削液が切削品質に与える影響を考えると、 ダイヤモンドワイヤーループ, いくつかの要因が関係してきます. 切削油剤の選択は、切削プロセスの効率と有効性に大きな影響を与える可能性があります. ここでは、考慮すべき点をいくつかご紹介します: 切削液の概念: 切削液, 切削油またはクーラント液とも呼ばれます, 油性および水ベースの形態で来て来て下さい, 清掃など複数の目的に対応, 潤滑, 加工プロセス中の冷却. These fluids are crucial in...

Alternatives to Circular Saw and Band Saw

Key Takeaways Diamond wire cutting is displacing internal circular saws and band saws in photovoltaic, 結晶, 珪素, magnetic materials and ceramic sectors because it cuts faster, safer and with less damage. Modern wire saw machines cut 1000mm-wide optoelectronic crystals without cracks, raising cutting efficiency eightfold and lowering the manufacturing cost of valuable crystals. The diamond cutting wire loop combines lightning-fast cutting speed with safety and durability, opening new fields beyond traditional sawing. Crystal producers are expected to phase out old circular and band saw...

カスタム超大型ダイヤモンドワイヤーソー機械

で Ensolltoolsの, 私たちは、専門的な研究開発チームに誇りを持っています, クライアントのためにカスタマイズされたソリューションを作成する能力. 最近, 当社のテーラード超大型ダイヤモンドワイヤーソーマシンは、高い評価を得ています, 特にシリコン切断用途, 高い満足度を誇るクライアントと. Customized machine display https://www.youtube.com/watch?v=Kzy_RECkG9U With over a decade of dedicated focus in the realm of cutting hard and brittle materials, 太陽光発電業界でも, 磁性材料, 石の切断, またはさまざまな結晶構造, we have amassed a wealth of...

単結晶シリコンインゴットの加工フロー

Key Takeaways A single-crystal silicon ingot goes through cropping, diameter grinding, スライス, edge chamfering, lapping and polishing before it is ready for lithography. Surface accuracy at the slicing stage determines how much downstream planarization work is required. Diamond wire slicing is the standard way to turn an ingot into bare wafers with tight thickness variation and low sub-surface damage. 単結晶シリコンウェーハ準備段階, the silicon single-crystal ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy...