Annular Diamond Wire Saw for Cutting Ceramics

現在は, 硬くて脆い材料の鋸引きおよび切断プロセスは、処理効率の低さなどの問題に悩まされています, low material yield, poor surface quality and integrity, high tool costs, and environmental pollution. When using circular saws to cut materials like stone and 陶芸, the saw blades need to possess a certain thickness to ensure rigidity. This results in wide kerfs, low material yield, and significant pollution. かつ, circular saws are unable to perform shaped surface machining, leading to inferior surface quality when cutting ceramic materials. In the semiconductor industry, the use of free abrasive wire cutting methods to process silicon crystals results in significant surface and environmental contamination by diamond abrasive slurry, thereby increasing the costs associated with subsequent processing and waste treatment.

ダイアモンドワイヤーソー is a hard and brittle material cutting method that has experienced rapid development in the past decade, primarily involving the use of free abrasive and bonded abrasive types. Based on the wire saw’s motion and machine structure, it can also be classified as reciprocating and unidirectional wire saws. 現在は, reciprocating multi-wire saws using free abrasives dominate in the semiconductor and optoelectronic industries. To address issues such as low cutting speeds and abrasive slurry contamination, the diamond unidirectional wire saw utilizing bonded abrasives has been proposed. This type of wire saw features a simple structure, enables high-speed wire movement, and allows for shaping operations, thus holding significant practical importance in advancing equipment for processing hard and brittle materials. The bonded abrasive diamond annular wire saw offers the following advantages:

(1) Narrow kerf, high material yield. By using high-strength steel wire as the base material, various wire saws with diameters below 1mm can be produced. Companies like Sumitomo Electric Industries and Lid in Japan have manufactured wire saws with average diameters ranging from 0.175 to 0.180mm using steel wires with diameters of 0.130 and 0.155mm as the base material, achieving an actual kerf loss of 0.19mm in sodium glass cutting experiments.

(2) Fast cutting speed, 高効率. The bonded abrasive annular diamond wire saw features unidirectional movement of the wire saw during the cutting process, with the abrasive grains fixed on the wire saw, eliminating the difficulty of abrasive entry into long and deep kerfs. Compared to reciprocating structures and wire saws using free abrasives, it is easier to achieve higher cutting speeds, resulting in high processing efficiency.

(3) Smooth cutting process, good slice surface quality. During the cutting process with a diamond wire saw, the cutting force is small and gentle, without the unique grooves generated on the workpiece surface due to reciprocating wire saw movement.

(4) Minimal environmental pollution. Bonded abrasive diamond wire saws typically use water as the standard coolant, and dry cutting methods can even be employed at lower wire speeds. This results in low or no need for wastewater treatment due to the use of bonded abrasives.

おわりに, in today’s increasingly widespread applications in non-conductive materials, semiconductor materials, および複合材料, the bonded abrasive diamond wire saw demonstrates unique advantages in cutting hard and brittle materials. でも, current research and applications are insufficient, particularly in areas such as wire saw manufacturing technology, cutting processes and mechanisms, diamond wire saw failure modes and mechanisms, and wire saw posture and motion control technologies in precision shaping cutting. There are many significant gaps that warrant further exploration. This study aims to explore electroplated diamond wire saw cutting technology, deeply understand its cutting mechanisms, and promote the precise and efficient processing of hard and brittle materials, which holds important significance.
Annular saws suit certain shapes; for flat precision work the reference is precision cutting of alumina.