業界ニュースアーカイブ - ページ 13 の 21

Industry news and market insights on diamond wire cutting, precision machining and advanced materials.

Recycling Sapphire Kerf Waste: Research

Key Takeaways Sapphire wafers are about 0.2 mm thick — close to the diamond wire diameter — so roughly 40-50% of every ingot becomes cutting-waste powder washed away by coolant, and most of it has historically been landfilled. Analysis of washed, dried and sieved diamond-wire cutting waste shows alpha-alumina as the main component, with nickel (0.70%) and diamond (0.164%) as the main impurities. Ultrasound acid leaching beats conventional acid leaching for nickel removal: nickel falls to 0.009% at a 99.67% leaching ratio, そして。。.

12月 31, 2024業界ニュース続きを読む...

Resin Hardness vs Diamond Wire Loop Performance

要約: この研究では、さまざまな樹脂バインダーがダイヤモンドワイヤーループの切断性能に与える影響を調査します. Resin-cured hardness samples were prepared using pure phenolic resin, epoxy-modified phenolic resin, and aromatic alkyl-modified phenolic resin, and their Rockwell hardness was tested. The fractured surfaces of the cured resin samples were observed using scanning electron microscopy, revealing varying levels of density post-curing. Diamond wire loops were then manufactured for single crystal silicon cutting experiments. The experimental results demonstrate that diamond wire loops...

12月 27, 2024業界ニュース続きを読む...

KDP結晶に最適な切断方法

Introduction to KDP Crystals KDP crystals have a large nonlinear optical coefficient and a high laser damage threshold, making them important component materials in optical systems for high-energy engineering. KDP crystals belong to hard-to-process brittle materials, distinguishing them from traditional metal materials processing. Manufacturing Process of KDP Crystals The manufacturing process involves cutting into a rough shape and then a precision cut. Cutting is the first step in processing KDP crystal materials. Due to localized stress in the crystal blank, the entire crystal...

12月 27, 2024業界ニュース続きを読む...

Cutting Fluid Impact on Diamond Wire Loop Quality

切削液が切削品質に与える影響を考えると、ダイヤモンドワイヤーループ, いくつかの要因が関係してきます. 切削油剤の選択は、切削プロセスの効率と有効性に大きな影響を与える可能性があります. ここでは、考慮すべき点をいくつかご紹介します: 切削液の概念：切削液, 切削油またはクーラント液とも呼ばれます, 油性および水ベースの形態で来て来て下さい, 清掃など複数の目的に対応, 潤滑, 加工プロセス中の冷却. These fluids are crucial in...

12月 18, 2024業界ニュース続きを読む...

単結晶シリコンインゴットの加工フロー

Key Takeaways A single-crystal silicon ingot goes through cropping, diameter grinding, スライス, edge chamfering, lapping and polishing before it is ready for lithography. Surface accuracy at the slicing stage determines how much downstream planarization work is required. Diamond wire slicing is the standard way to turn an ingot into bare wafers with tight thickness variation and low sub-surface damage. 単結晶シリコンウェーハ準備段階, the silicon single-crystal ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy...

12月 4, 2024業界ニュース続きを読む...

多様な半導体: 種類とその用途

What is a Semiconductor A semiconductor chip, 一般に集積回路と呼ばれます, は、半導体ウェーハ上にエッチングなどのプロセスで作製する半導体デバイスです, 配線, 特定の機能を実現するためのパターニング. シリコンチップを超えて, 一般的な半導体材料には、ガリウムヒ素が含まれます, 窒化ガリウム, および炭化ケイ素. 最終レビュー: 9 月 2026 Key Takeaways Semiconductors are materials with conductivity between conductors and insulators, forming the basis of all integrated circuits. Beyond silicon, key semiconductor types include gallium arsenide (GaAsの), 窒化ガリウム (GaNの) and silicon...

12月 4, 2024業界ニュース続きを読む...

半導体を理解する: Origins Explained

Key Takeaways A semiconductor is a material with properties between an insulator and a conductor, controllable through doping and electric fields. Understanding semiconductors evolved from early crystal detectors to the transistor and today's integrated circuits. This controllable conductivity is what makes all modern electronics possible. 半導体とは? 簡単に言えば, a semiconductor is a material that exhibits properties between an insulator and a conductor. Insulators are materials that do not conduct electricity, while conductors are materials that conduct electricity. Semiconductors possess characteristics that lie...

11月 29, 2024業界ニュース続きを読む...

ダイヤモンドワイヤーソー切断機購入ガイド

Key Takeaways Diamond wire saw cutting machines come in four main structures - 垂直, 水平な, gantry and irregular - each suited to different cutting applications. Vertical machines cut into the workpiece from any point on the side; reciprocating wire can enter from the center, while loop wire cuts from the periphery. Horizontal machines cut parallel to the workpiece, and both structures support programmed cut-retract-re-engage cycles with adjustable depth. Gantry machines cut top-down and are primarily used for slicing tasks. Diamond wire is available from 0.3mm...

11月 28, 2024業界ニュース続きを読む...