다이아몬드 와이어 루프 절단의 장점은 무엇입니까?

Diamond-Wire Loop 절단 기술은 기존의 자유 모르타르 절단을 대체하는 고급 절단 기술입니다, which is widely used in the field of silicon wafer cutting in photovoltaic and semiconductor industries.

Its development process is as follows:

Phase One: The Era of Free Abrasive Slurry Cutting Monopoly

Prior to the maturation of diamond wire technology, the cutting of solar cells and semiconductor silicon wafers predominantly relied on Free Abrasive Slurry Cutting (FASC). This method involved high-speed steel wires carrying a slurry—a mixture of abrasives like silicon carbide or zirconium corundum with polyethylene glycol—to slice silicon ingots through a “three-body abrasion” mechanism.

하지만, this technique presented significant drawbacks:

• Low Efficiency and High Material Loss: The cutting speed was slow, and the resulting kerf was wide (typically exceeding 200 microns), leading to the waste of over 40% of the expensive silicon material during the process.
• Severe Pollution and High Costs: It generated large volumes of waste slurry that were difficult to handle, incurring high subsequent cleaning and disposal costs.
• Deep Surface Damage: The uncontrolled cutting process often caused deep damage layers on and beneath the wafer surface, adversely affecting further processing and the performance of the final solar cells.

 

2단계: Pioneering Application of Diamond Wire by Japanese Enterprises

Japanese companies, notably Asahi Diamond Industrial Co., 주식 회사. and Nakamura Choukou Co., 주식 회사., achieved a technological breakthrough. They employed an electroplating process to firmly “plant” micron-sized diamond particles onto high-strength steel wire substrates, creating a diamond wire with “fixed abrasives.”

 

The fundamental cutting mechanism shifted from “three-body abrasion” 받는 사람 “two-body abrasion”: the diamond particles, acting as fixed cutting edges, directly engaged with the material without rolling. This innovation increased cutting efficiency severalfold compared to the free abrasive method. In the early 2000s, this technology was primarily used for precision cutting of high-value, hard, and brittle materials like sapphire and optical glass. The wires were relatively thick and represented a specialized, high-end tool.

 

Phase Three: The Breakthrough of Thinner Wires and the Dawn of Photovoltaic Application

As the photovoltaic (태양광 발전) industry’s demand for cost reduction grew more urgent, the sector recognized that “wire diameter directly determines silicon material loss.” To achieve narrower kerfs and increase yield (more wafers per kilogram of silicon ingot), “thinner wire” development became the core focus of technological advancement.

 

Japanese companies continued to lead this progression, gradually reducing the diamond wire diameter from initial hundreds of microns to 17.5mm and even 14.5mm levels. Each reduction in diameter demanded more precise electroplating techniques and stronger wire substrates. This phase marked the expansion of diamond wire technology from niche applications like sapphire cutting into the realm of large-scale PV silicon wafer slicing, demonstrating immense potential for cost reduction.

4단계: The Rise of Chinese Enterprises and Global Industrial Adoption

Although the technology originated in Japan, the widespread global adoption and significant cost reduction of diamond wire cutting in the PV industry were primarily driven by Chinese enterprises. Companies such as Diamond Wire Technology Co., 주식 회사. and DaLee New Materials Co., 주식 회사. achieved key technological breakthroughs and scaled up production in the mid-to-late 2010초.

 

The contributions of Chinese manufacturers are mainly reflected in:

• Scale and Cost: Through massive capacity expansion and technological optimization, they brought down the high cost of diamond wire to a level widely acceptable for the PV industry.
• Technological Advancement: They persistently drove the “thinner wire” competition, pushing the mainstream diameter to 80μm, 60μm의, and currently to the mass-produced 35μm level, drastically reducing silicon material costs.
• Process Integration: Through close collaboration with major Chinese wafer manufacturers (예), 룽이(LONGi), TCL Zhonghuan), they jointly perfected the complete set of cutting processes, establishing it as the industry standard.

 

The market landscape was consequently transformed. 곁에 2017, diamond wire cutting had completely replaced slurry cutting, becoming the mainstream process for crystalline silicon wafering, with a penetration rate exceeding 95%. 오늘, China holds the vast majority of the global diamond wire production capacity. 뿐만 아니라, it is propelling the application of this technology into broader semiconductor and precision machining fields, 실리콘 카바이드 포함, 사파이어, and magnetic materials.

The advantages of diamond Wire loop cutting mainly include——Cutting speed, 고효율, high productivity.

Higher precision and lower damage layer, material loss and burn when cutting thin sheets, which is conducive to cutting thinner silicon wafers or other high-value raw materials.

Quality control, low cost per piece.

The use of water-based grinding fluid is conducive to improving the working environment and simplifying the post-processing procedures such as cleaning, which is simple and environmentally friendly.

그러므로, diamond loop cutting has become the mainstream cutting process for crystalline silicon slicing in the photovoltaic industry. 이래 2015, Ensolltools Technology Co., 주식 회사. began to deeply cultivate the field of diamond wire saw cutting, product competitiveness continues to improve, and market share increases year by year.

In terms of diamond loop, the company continues to lead the industry in fining, has broken through the 0.3mm diamond loop technical barriers, and actively develop reserves and trial production of finer diameter diamond loop, With the diamond loop cutting equipment developed by us, thinner wire diameter helps to reduce the cutting loss of raw materials, especially rare and valuable materials, while improving cutting accuracy and efficiency. Reduce cutting energy consumption.