光学玻璃切割: Diamond Wire Saw vs Laser
Optical glass machining requires sub-micron precision to meet the demands of industries like aerospace, photonics, 以及消费电子产品. 凭借 无尽金刚石线锯 and laser cutting emerging as dominant technologies, manufacturers face a critical choice. This guide analyzes both methods across 7 key parameters to help you make data-driven decisions. Key Takeaways Diamond wire saw cutting removes material by diamond grit abrasion (wire 0.1-0.3 毫米, 5-30 米/秒) and holds +/-0.02-0.03 mm tolerance; laser cutting vaporizes material and typically holds +/-0.05 毫米. Cut...





