단결정 실리콘 잉곳 가공 흐름
주요 요점: 단결정 실리콘 잉곳은 크롭핑을 거칩니다, 직경 연삭, 깔 끔 히, 모서리 모서리 캐핑, lapping and polishing before it is ready for lithography. Surface accuracy at the slicing stage determines how much downstream planarization work is required. Diamond wire slicing is the standard way to turn an ingot into bare wafers with tight thickness variation and low sub-surface damage. 단결정 실리콘 웨이퍼 준비 단계에서, the silicon single-crystal ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy...