Single Crystal Silicon Ingot Processing Flow
Key Takeaways A single-crystal silicon ingot goes through cropping, diameter grinding, スライス, edge chamfering, lapping and polishing before it is ready for lithography. Surface accuracy at the slicing stage determines how much downstream planarization work is required. Diamond wire slicing is the standard way to turn an ingot into bare wafers with tight thickness variation and low sub-surface damage. 単結晶シリコンウェーハ準備段階, the silicon single-crystal ingots need to be processed into raw silicon wafers or barewa-fers with high surface accuracy...
