엔드리스 다이아몬드 와이어 톱으로 자기 재료 절단

엔솔 엔드리스 다이아몬드 와이어 톱을 이용한 자기 재료 정밀 절단

엔드리스 다이아몬드 와이어 톱으로 자기 재료 절단

Test scope: Precision straight slicing of a cylindrical magnetic-material sample supplied by a European customer, using an Ensoll ESO-GM endless diamond wire saw.

주요 요점

  • Five 3.780 mm slices cut from a 15 mm magnetic-material cylinder held within-slice TTV of 0.008-0.011 밀리미터, averaging 0.009 밀리미터.
  • Average surface roughness stayed between Ra 0.71-0.88 micrometers and maximum edge chipping was 9.2 micrometers — a stable, finishing-ready cut.
  • Average slice thickness drifted downward across the sequence (-0.083 mm by slice five), so batch production needs thickness-offset or wire-bow compensation.
  • The result came from a matched system: a rigid gantry machine with real-time tension control, a 0.5 mm fully coated diamond wire loop and cutting-oil cooling.

Magnetic materials are hard and brittle, 상대적으로 낮은 파단 인성을 가짐. During slicing, cutting force, frictional heat, and internal stress can cause edge chipping, microcracks, thickness variation, and surface damage. This test evaluated whether an endless diamond wire process could maintain stable slice geometry and surface integrity while cutting a 15 mm diameter sample.

Where the workpiece is NdFeB rather than ferrite, the settings in our 네오디뮴 자석 절단 방법 guide are the safer starting point.

Measured Results at a Glance

  • Workpiece: Magnetic material, approximately Mohs 6-7
  • Sample dimensions: 15 mm diameter x 103 mm length
  • Nominal slice thickness: 3.780 밀리미터
  • TTV: 0.008-0.011 mm across five slices; average 0.009 밀리미터
  • Average surface roughness (Ra): 0.71-0.88 마이크로미터
  • Maximum measured edge chipping: 6.7-9.2 micrometers by slice

The results show good thickness uniformity within each individual slice and consistently low surface roughness. The gradual change in average thickness across the five slices also identifies an important process-control opportunity: tighter multi-slice batch consistency would require offset or feed compensation during production.

1. Test Objective and Process Strategy

The customer required high-precision straight slicing with controlled thickness variation, 표면 거칠기, and edge damage. Ensoll selected the ESO-GM endless diamond wire saw, cutting oil, and a fully coated diamond wire loop as a matched process system.

Cutting oil was used to improve lubrication and heat removal in the cutting zone. The fully coated wire provides a stable abrasive distribution and consistent material removal, while the machine’s tension-control system helps reduce wire-position fluctuation during the cut.

ESO-GM endless diamond wire saw used for precision slicing magnetic materials
도표 1. ESO-GM endless diamond wire cutting equipment.

2. Equipment and Cutting Parameters

The ESO-GM uses a rigid gantry structure with top-down vertical feed. Its integral cast-iron frame is designed to limit vibration and structural deformation during long cutting cycles. The system also includes real-time tension control, wire-break position memory, and mist extraction for oil-cooled processing.

매개변수 Test Setting
Machine ESO-GM endless diamond wire saw
와이어 직경 0.50 밀리미터
Diamond wire loop length 1930 밀리미터
Feed-rate setting 2 / 1 mm / 분
절단 폭 15 밀리미터
와이어 장력 180 N
Linear wire speed 26 엠/초
Wire-bowing time 100 초
Recorded cutting load 25 N·m
냉각 및 윤활 절단유

Customers evaluating similar hard and brittle components can also review Ensoll’s magnetic-material cutting machines 그리고 다이아몬드 와이어 루프.

ESO-GM magnetic material slicing parameter interface
도표 2. Cutting-process parameter interface used during the test.
Endless diamond wire precision slicing a cylindrical magnetic material sample
도표 3. Magnetic-material slicing process with the endless diamond wire.

3. 총 두께 변동 (TTV)

Each slice was measured at nine positions using a vacuum-chuck, dual-probe thickness measurement method. The TTV value is the difference between the maximum and minimum measured thickness on the same slice.

시료 Nine-Point Thickness Measurements (밀리미터) Tmax Tmin TTV
S01 3.784, 3.781, 3.786 / 3.779, 3.782, 3.785 / 3.780, 3.783, 3.778 3.786 3.778 0.008
S02 3.792, 3.788, 3.790 / 3.786, 3.789, 3.791 / 3.787, 3.793, 3.785 3.793 3.785 0.008
S03 3.775, 3.778, 3.781 / 3.772, 3.776, 3.779 / 3.774, 3.780, 3.773 3.781 3.772 0.009
S04 3.741, 3.745, 3.748 / 3.739, 3.743, 3.746 / 3.740, 3.744, 3.742 3.748 3.739 0.009
S05 3.695, 3.699, 3.703 / 3.692, 3.696, 3.701 / 3.694, 3.698, 3.697 3.703 3.692 0.011

Interpretation: TTV remained between 0.008 그리고 0.011 밀리미터, with an average of 0.009 밀리미터. This indicates stable local thickness uniformity within each slice.

4. Average Thickness and Dimensional Drift

The nominal slice thickness was 3.780 밀리미터. Average thickness was calculated from the nine measurements for each sample.

시료 Average Thickness (밀리미터) Deviation from 3.780 밀리미터
S01 3.782 +0.002 밀리미터
S02 3.789 +0.009 밀리미터
S03 3.776 -0.004 밀리미터
S04 3.743 -0.037 밀리미터
S05 3.697 -0.083 밀리미터

Interpretation: The observed deviations ranged from -0.083 받는 사람 +0.009 밀리미터. Although the within-slice TTV remained stable, the average thickness decreased over the sequence. For applications with a tight batch-level thickness tolerance, this trend should be addressed through programmed thickness-offset compensation, feed adjustment, or wire-bow compensation.

5. 표면 거칠기

Surface roughness was measured with a stylus profilometer at three representative positions on each cut surface, following the Ra definition in ISO 4287.

시료 Ra-1 Ra-2 Ra-3 평균 Ra (마이크로미터)
S01 0.81 0.85 0.79 0.82
S02 0.74 0.78 0.76 0.76
S03 0.69 0.73 0.71 0.71
S04 0.86 0.91 0.88 0.88
S05 0.77 0.82 0.79 0.79

Interpretation: Average Ra remained within 0.71-0.88 마이크로미터. The narrow range indicates a stable abrasive cutting state and a consistent surface suitable for subsequent precision finishing.

6. 모서리 칩핑 결과

Edge chipping was measured at four positions on each slice using an optical tool microscope.

시료 위치 1 위치 2 위치 3 위치 4 Maximum Chipping (마이크로미터)
S01 5.2 7.1 4.6 6.3 7.1
S02 4.8 6.5 5.6 7.4 7.4
S03 4.1 5.8 5.0 6.7 6.7
S04 6.3 9.2 5.8 8.6 9.2
S05 5.1 7.6 6.2 8.1 8.1

Interpretation: The largest measured chip was 9.2 마이크로미터, and the average of the five maximum values was 7.7 마이크로미터. The edges remained visually intact with limited brittle-fracture damage.

Cut surface of a magnetic material slice produced with an endless diamond wire saw
도표 4. Magnetic-material slice after cutting.

7. 공학적 결론

This test demonstrates that the ESO-GM endless diamond wire process can produce magnetic-material slices with low within-slice TTV, consistent sub-micrometer Ra values, and limited edge chipping. The combination of a rigid machine structure, real-time tension control, a fully coated diamond wire loop, and oil cooling supported a stable cutting condition.

The data should also be read carefully: TTV describes uniformity within each slice, while the average thickness values show a downward trend across the five-slice sequence. Before volume production, the process should therefore be validated against the customer’s drawing tolerance and, where necessary, supplemented with automatic thickness or wire-bow compensation.

For a different magnetic-material machining requirement, see Ensoll’s irregular-profile magnetic-material cutting test.

Citation permission: If you find this article helpful, Ensoll authorizes you to quote or reference it, provided that you include a link to this page as the original source.

자주 묻는 질문

What is TTV in precision slicing and why does it matter?

TTV (total thickness variation) is the difference between the thickest and thinnest points on one slice. Low TTV means uniform slices, which reduces downstream lapping and keeps magnetic component tolerances tight. This test held TTV between 0.008 그리고 0.011 밀리미터.

Why does slice thickness drift during multi-slice production?

As cutting progresses, wire wear and wire bow slowly change the effective cut position, so later slices can come out thinner or thicker. The fix is programmed thickness-offset compensation, feed adjustment, or wire-bow compensation before volume production.

What level of edge chipping is acceptable when slicing hard, brittle magnets?

It depends on the drawing, but single-digit micrometers is considered clean. In this test the largest measured chip was 9.2 micrometers and edges remained visually intact with limited brittle-fracture damage.

Why use cutting oil when slicing magnetic materials?

Cutting oil improves lubrication and heat removal in the cutting zone and helps evacuate swarf, which keeps the wire cutting stable and the workpiece cool throughout long slicing cycles.

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