在现代制造环境中, 对高性能组件的需求导致硬脆材料的广泛采用. 材料如碳化硅 (原文如此), 技术陶瓷, 光学玻璃, 以及稀土磁体 (如NdFeB和SmCo) are essential for next-generation electronics, 航空 航天, and renewable energy technologies.
然而, machining these materials presents a massive engineering paradox: their extreme hardness makes them highly durable in application, but their lack of plasticity makes them incredibly difficult to cut without causing catastrophic cracking...