ダイヤモンドワイヤーソー切断機

Ensoll is a leading manufacturer of precision diamond wire saw machines in China, 自社のRを持っています&Dチーム. Our machines are engineered for cutting 硬くて脆い材料—such as semiconductor silicon, サファイア, 炭化ケイ素, technical ceramics, and optical glass—where kerf loss, surface quality, and dimensional accuracy matter most. (Heavy construction materials like concrete or stone use different machinery; our focus is precision applications.) Below is an overview of our diamond wire saw cutting machines:
Not sure which setup fits your material? See our application guides: silicon wafer slicing, silicon carbide cutting, technical ceramics cutting, そして 光学ガラス切断.

ESG200-2T

This equipment is a gantry cutting machine. “ESの” 表します “エンソール,” これは私たちのブランドです. “G” ガントリーの垂直方向の切断動作を表します。. “200” 容量を表します。, そして “2T” この機械に無限のダイヤモンド ワイヤーを回すための2つのゴム製車輪があることを意味します. This is the significance of our equipment name.

切削パラメータ:

• 最大切断サイズ: 200200200ミリメートル (length * width * height)
• 送り長さ: 200*200ミリメートル (Y * Z軸)
• 調整可能な切断厚さ: 0.1-200ミリメートル

Equipment Features:

• Customized and compact structure, with dimensions of 8006801610mm
• 防水ボディ, suitable for wet cutting.
• Tensioning system adopts adaptive tensioning system, eliminating the need for tensioning force calculation.
• No noise pollution, stable cutting effect, and higher accuracy.

ESG200-2T-S

This equipment is a multi-angle cutting machine. “S” represents rotation, meaning that this machine has an added rotation function on the basis of ESG200-2T, allowing for multi-angle cutting.

切削パラメータ:

• 最大切断サイズ: 200200200ミリメートル (length * width * height)
• 送り長さ: 200*200ミリメートル (Y * Z軸)
• 調整可能な切断厚さ: 0.1-200ミリメートル

Equipment Features:

• Optional installation of a tilting worktable for multi-angle cutting
• The worktable can rotate horizontally 360° and tilt downwards from 0° to 15°
• Automatic tension adjustment structure does not require manual adjustment
• Equipped with an endless diamond wire, which can be easily replaced in just 1 minute

ESG400-4T

This equipment is a gantry cutting machine, similar to ESG200-2T, but with an enlarged size. It has two additional wheels and is more suitable for cutting large-sized products.

切削パラメータ:

• 最大切断サイズ: 400400400ミリメートル (length * width * height)
• 送り長さ: 400*400ミリメートル (Y * Z軸)
• 調整可能な切断厚さ: 0.1-400ミリメートル.

Equipment Features:

• Larger size for cutting larger-sized products
• Equipment dimensions: 10038821756ミリメートル (length * width * height)

ESV-3S

This equipment is a manual three-wheel machine with “V” representing vertical cutting. It is the only manual machine and has a small size, making it suitable for laboratory use or competitions.

切削パラメータ:

• 最大切断サイズ: 3502350350ミリメートル (length * width * height)
• 調整可能な切断厚さ: 0.1-400ミリメートル

Equipment Features:

• Customized and compact structure, convenient to carry and move
• No restriction on cutting width

ESH300-2T

This equipment is a horizontal cutting machine, with “H” representing horizontal cutting.

切削パラメータ:

• 最大切断サイズ: 300300300ミリメートル (length * width * height)
• 送り長さ: 300300300ミリメートル (X axis * Y 軸 * Z軸)
• 調整可能な切断厚さ: 0.1-300ミリメートル

Equipment Features:

• Equipped with a rotating cutting function
• Cutting time is reduced by 50%, and cutting efficiency is increased by 55%
• Good cutting quality and long equipment life
• No noise pollution, stable cutting efficiency, and high precision

ESH600-4T型

This equipment is also a horizontal cutting machine, larger in size compared to ESH300-2T. It has two additional wheels and can cut larger materials.

切削パラメータ:

• 最大切断サイズ: 600800450ミリメートル (length * width * height)
• 調整可能な切断厚さ: 0.1-450ミリメートル

Equipment Features:

• Equipped with a rotating cutting function
• Larger cutting size compared to similar equipment
• No noise pollution, stable cutting efficiency, and high precision

ESV260-4T

This equipment is a high-precision machine for vertical cutting. It has a small dimensional tolerance and is equipped with four wheels to achieve high-precision cutting and reduce material loss.

切削パラメータ:

• 最大切断サイズ: 250*250*250ミリメートル (length * width * height)
• 最高速度：2800 RPM

Equipment Features:

• Customized and compact structure, suitable for small-sized products
• Equipped with four wheels for stable cutting and reduced material loss
• High-precision cutting, ensuring product quality
• No noise pollution, stable cutting efficiency, and high precision

Frequently Asked Questions

What materials can a precision diamond wire saw machine cut?

Hard and brittle materials: semiconductor silicon, サファイア, 炭化ケイ素 (ティッカー), technical ceramics, 光学ガラス, 石英, 石墨, and magnetic materials. These machines are built for precision cutting with minimal kerf loss and high surface quality. Concrete and stone cutting use different, heavy-duty wire saw equipment.

How do I choose the right machine size?

Match the machine’s maximum cutting size to your largest workpiece: ESG200 models handle up to 200 ミリメートル, ESH300 up to 300 ミリメートル, ESG400 up to 400 ミリメートル, and ESH600 up to 600 ミリメートル. For laboratory work or small-scale R&D, the compact ESV-3S is often sufficient.

What cutting thickness can these machines achieve?

Cutting thickness is adjustable from 0.1 mm upward. The diamond-coated wire produces a very narrow kerf, which minimizes material loss and delivers stable, high-precision cuts with good surface quality.

Can these machines be used in a laboratory or for R&D?

はい. The ESV-3S is a compact manual machine designed for laboratory use and teaching, while the larger models suit pilot lines and production environments.