사파이어 커프 폐기물 재활용: 연구
- Sapphire wafers are about 0.2 mm로, 다이아몬드 와이어 직경과 비슷하며, 대략 40-50% 모든 주괴가 냉각재에 의해 씻겨 나가는 절단 폐기물 가루가 된다, 그리고 대부분은 역사적으로 매립지였다.
- 세척된 분석, 건조 및 체로 체화된 다이아몬드 와이어 절단 폐기물 분석 결과 알파알루미나가 주요 성분으로 나타난다, 니켈과 함께 (0.70%) 다이아몬드 (0.164%) 주요 불순물.
- 초음파 산 침출이 니켈 제거에 기존 산 침출보다 더 능하다: 니켈이 낮아짐 0.009% a 99.67% 침출 비율, and nickel sulfate crystals are recovered at 95.32% via extraction, back-extraction and crystallization.
- Burning the leached waste in oxygen removes the residual diamond from 0.164% 받는 사람 0.00062% (99.62% removal), following a reaction-controlled shrinking core model.
- The purified alpha-Al2O3 reaches 99.99% purity — basically meeting the requirement for reproducing sapphire single crystal, turning a pollutant into a resource.
최근 몇 년 동안,과학 기술의 진화,사파이어 웨이퍼는 LED와 전자 산업에서 beenwidely 적용되고 웨이퍼의 사파이어 wafer.The 간격으로 저미어질 때까지 LED 분야에 직접 적용될 수 없는 전자 industry.Sapphire 주괴는 대략 0.2mm입니다,다이아몬드 와이어의 직경에 가까움,which means about 40%~50%sapphire ingot materials are transformed into powder washed away by the cooling liquid.

우선,the analysis of the cutting waste after washing,drying and sieving shown that the main component of the cutting waste is alpha alumina with nickel and diamond as main impurities,where the contents of impurity nickel and diamond were 0.70%and 0.1 64%,respectively.Then,the efficient conditions of conventional acid leaching and ultrasound acid leaching of nickel were determined.Under these conditions,the content of nickel reduced
from 0.70%to 0.0 1 2%and 0.009%with 98.25%and 99.67%leaching ratio,respectively.As can be seen that ultrasound acid leaching is beRer than conventional acid leaching.Kinetic analysis of ultrasound acid leaching and conventional acid leaching shown that the process of Ni reacting with acid is controlled by chemical reaction.By determining the optimum conditions of extraction and baci-extraction,the recovered solution was evaporated and crystallized to obtain nickel sulfate crystals with a recovery rate of 95.32%.

자주 묻는 질문
Why should sapphire cutting waste be recycled?
Because sapphire wafers (~0.2 mm) are nearly as thin as the diamond wire itself, 40-50% of each expensive ingot turns into waste powder during slicing. This waste was mostly dumped or landfilled, wasting a valuable resource and polluting the environment, so recovering the alpha-alumina for new crystal growth brings major economic and environmental benefits.
What impurities are in sapphire diamond-wire cutting waste?
After washing, drying and sieving, the waste is mainly alpha-alumina with two key impurities: nickel at 0.70% and diamond at 0.164%, both introduced by the wire sawing process itself.
How is nickel removed from sapphire cutting waste?
By acid leaching, and ultrasound-assisted leaching outperforms the conventional method: nickel content drops from 0.70% 받는 사람 0.009% a 99.67% 침출 비율, versus 0.012% 그리고 98.25% for conventional leaching. The recovered solution yields nickel sulfate crystals at a 95.32% recovery rate through extraction, back-extraction, evaporation and crystallization.
Can purified sapphire cutting waste be reused to grow new sapphire?
예. After leaching removes the nickel and optimized oxygen burning removes the diamond (down to 0.00062%, a 99.62% removal rate), the alpha-Al2O3 purity reaches 99.99% — basically meeting the purity demand for reproducing sapphire single crystal ingots.
Ensoll 엔지니어링 팀의 검토.