Ensoll工具的综合文章和更新.
切割碳化硅基板: 技术指南
Introduction to Silicon Carbide Substrate Cutting Key Takeaways Silicon carbide's crystal structure and orientation strongly affect cutting behavior; optimizing the cutting direction improves both quality and wire life. The main SiC cutting methods — laser, multi-wire saw and diamond wire loop — trade cutting speed against surface damage. For SiC substrates, diamond wire loop cutting offers the best balance of surface quality, kerf loss and throughput. 碳化硅 (原文如此) 已成为一种革命性的半导体材料, transforming power electronics and high-temperature applications with its superior...
